Mold with micro pattern, method of forming the mold and transfer method where the mold is used to fo

专利摘要:
A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.
公开号:SE534274C2
申请号:SE0950640
申请日:2008-03-06
公开日:2011-06-28
发明作者:Hioshi Goto；Hiroshi Okuyama；Mitsunori Kokubo；Kentaro Ishibashi
申请人:Toshiba Machine Co Ltd；
IPC主号:

专利说明:

[5] It also follows, when forming ultra-micro-patterns for transfer on a stamp such as a quartz substrate using electron lithograph fi or the like, and when an area where a micro-pattern for transfer is to be created, has a large area, that stamp preparation (forming of the micro-pattern on the stamp) takes a long time. A device for executing the electron lithograph or the like has a high cost of working time (one cost per unit of time for using the device), which increases the price of the stamp.
[6] In addition, the material cost of a material such as quartz glass used as starch material is also high. Thus, when the area where the micro-pattern for transfer is formed has a large area, the size of the stamp itself increases, which increases the price of the stamp.
[7] In that regard, the following has been previously known. Especially, when the micro-pattern formed on the substrate 105 has a shape in which the same pattern is repeated, for example, when a micro-pattern for transfer is formed on a surface of a relatively small stamp. Thereafter, the micro-pattern for transfer is continuously applied to the resist layer 103, which is provided on the substrate 105. Thus, a continuous micro-pattern is formed over a large area of the substrate 105 in the same manner as in the case shown in Fig. 24. The above-mentioned method of forming the continuous micro-pattern is shown, for example, in the Japanese patent application with publication number 2006-191089 (Document 2). [ooos] It also follows, in the case where the continuous micro-pattern is formed over a large area of the substrate by coupling together micro-patterns for transfer as described above, that the resist layer swells due to a first transfer, for example. Thus, it is possible that a second transmission, continuous with the first transmission, will not be performed exactly.
[9] The above situation will be described in detail using Fig. 25 (showing a conventional transfer state). By performing a first transfer using stamp M20 (101), a micro-pattern P11 is formed on a resist layer W21 (103). During that course of events, together with the micro-pattern P11, an intumescent portion W22, and the like for the resist layer W21, is formed around the micro-pattern P111.
[11] For example, in the state shown in Fig. 25, when the piston M2O is lowered to form a micro-pattern in the part P12 of the resist layer W21, the resist layer in the swelling portion W22 located below the piston M2O has nowhere to take the scale and will thus be included in an extremely small concave portion located at the end (end of the portion P12 side) of the micro pattern P1 1.
[12] Since a precise micro-pattern cannot be formed on the resist layer W21, it is a problem that a shape of the micro-pattern to be formed on a substrate W2O (a micro-pattern corresponding to the micro-pattern formed on the substrate 105 in Fig. 24e; a micro-pattern formed by etching ) also does not become precise.
[13] The present invention was made in view of the above problems. An object of the present invention is to provide a method of producing a micro-pattern for continuously forming micro-patterns on a substrate, each of the micro-patterns corresponding to a micro-pattern for transfer, which is formed on a template, where the method is capable of forming micro-patterns with a more accurate shape of the substrate.
[15] A second aspect of the present invention is a method of forming micro-patterns for continuously forming micro-patterns on a substrate, each of the micro-patterns corresponding to a micro-pattern for transfer formed on a template, wherein the method of forming the micro-patterns includes: a first covering step for covering a surface of a lower transfer material on a substrate with a layer of an upper transfer material, wherein the surface of the substrate is covered with a layer of the lower transfer material, a first transfer step for transferring the micro-pattern for transfer to the upper transfer material, formed in the first covering step by pressing the template against the substrate with the layer of the upper transfer material provided on its surface by the first covering step; a first step of forming the micro-pattern to form a micro-pattern on the lower transfer material by etching after the transfer of the micro-pattern 534 274 through the first transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template; a first removal step for removing the upper transfer material provided in the first covering step after the formation of the micro-pattern by the first step of forming the micro-pattern; a second covering step for covering the surface of the lower transfer material with a layer of the upper transfer material after the removal of the upper transfer material in the first removal step; a second transfer step for transferring the micro-pattern for transfer to the upper transfer material formed in the second covering step by pressing a template against the substrate having the layer of the upper transfer material provided on its surface through the second covering step; a second micro-pattern forming step to form a micro-pattern on the lower transfer material by etching after the transfer of the micro-pattern in the second transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template; a second removal step for removing the upper transfer material provided in the second covering step after the formation of the micro-pattern in the second step before forming the micro-pattern; a third step of forming a micro-pattern to form the micro-pattern on the substrate by etching after the removal of the upper transfer material in the second removal step, the micro-pattern corresponding to the micro-pattern of the lower transfer material; and a third removal step for removing the lower transfer material after the formation of the micro-pattern in the third step of forming the micro-pattern.
[16] A third aspect of the present invention is a micropattern forming method for continuously forming micropattern on a substrate, each of the micropatterns corresponding to a transfer pattern formed on a template, wherein the micropattern forming method includes; a first covering step for covering a surface of a third material on the substrate with a layer of a transfer material, the substrate being formed by stacking a first material, a layer-like second material and a layer-like third material; a first transfer step for transferring the micro-pattern for transfer to the transfer material, which is formed in the first coverage step by pressing the template against the substrate with the layer of the transfer material provided on its surface in the first coverage step; a first step of forming a micro-pattern to form a micro-pattern on the third material by etching after the transfer of the micro-pattern in the first transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template; a first removal step for removing the transfer material provided in the first covering step, after the formation of the micro-pattern in the first step for forming micro-patterns; a second covering step for covering the surface of the third material with a layer of the transfer material after the removal of the transfer material in the first removal step; a second transfer step for transferring the micro-pattern prior to transfer to the upper transfer material, which is formed in the second coverage step by pressing a template against the substrate with the layer of the transfer material provided on its surface in the second coverage step; a second step of forming a micro-pattern to form a micro-pattern on the third material by etching after the transfer of the micro-pattern in the second transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template; a second removal step for removing the transfer material, which is provided in the second covering step after the formation of the micro-pattern in the second step for forming micro-patterns;
[17] A fourth aspect of the present invention is a micropattern forming method for continuously forming micropattern on a substrate, each of the micropatterns corresponding to a transfer pattern formed on a template, wherein the micropattern forming method includes: a first coating step for cover a surface with a layer of a transfer material; a first transfer step for transferring the micro-pattern for transfer to the transfer material formed in the first coverage step by pressing the template against the substrate with the layer of the transfer material provided on its surface in the first coverage step; a first supply step for providing a cover member on a portion where the substrate is exposed by transmitting the micro-pattern for transfer in the first transfer step; a first removal step for removing the transfer material, which is provided in the first covering step after covering the part where the substrate is exposed with the covering element in the first providing step; a second covering step for covering parts of the substrate surface with a layer of transfer material after the removal of the transfer material in the first removal step; a second transfer step for transferring the micro-pattern for transfer to the transfer material, which is formed in the second covering step by pressing a template against the substrate with the layer of transfer material provided on its surface in the second covering step; a second providing step for covering a portion where the substrate is exposed by transferring the micron pattern for transfer into the second transfer step with a cover member; a second removal step for removing the transfer material, which is provided in the second covering step after covering the part where the substrate is exposed with the covering elements in the second providing step; a micro-pattern forming step for forming a micro-pattern on the substrate by etching after removal of the transfer material in the second removal step, the micro-pattern corresponding to the micro-pattern for transfer to the template; and a third removal step for removing the cover elements, which are provided in the first and second provisioning steps after the formation of the micro-pattern, the step of forming a micro-pattern formation.
[18] A fifth aspect of the present invention is a forming method according to any one of the first four aspects, which further includes: a position relational detecting step for detecting a positional relationship between the micro-pattern, which is formed in the first step of forming the micro-pattern and the micro-pattern for transmission. formed on the template after the micro-pattern is formed in the first step of forming the micro-pattern and before the transfer is performed in the second transfer step; and a correction step for correcting a position of the template relative to the substrate based on a result of the detection in the position relation detecting step, so that the micro-pattern for transfer to be formed in the second step of forming a micro-pattern is precisely coupled to the micro-pattern formed in the first step of forming micro-pattern.
[19] A sixth aspect of the present invention is a micro-pattern forming method according to the fifth aspect, in which the correction step is a step of performing the correction by compensating a change in shape of the template to the correct shape by using an actuator.
[20] A seventh aspect of the present invention is a micro-pattern forming method according to the fifth aspect, in which, through the first transfer step and the first step of forming micro-patterns, micro-patterns are formed in a first part of the transfer material and in a second part separate from the first part at a predetermined distance; through the second transfer step and the second step for forming micro-patterns, a micro-pattern is formed in a third part joining the first and second parts; and the position relational detecting step is a step of detecting a positional relationship between the micro-pattern formed in the first step of forming the micro-pattern and the micro-pattern of transfer formed on the template by detecting a relative positional deviation of the micro-pattern for transfer to the template at a boundary between the first part and the micro-pattern for transfer formed on the template and by detecting a relative positional deviation of the micro-pattern for transfer on the template at a boundary between the second part and the micro-pattern for transfer formed on template.
[21] An eighth aspect of the present invention is a micro-pattern forming method according to the seventh aspect of the present invention, in which a portion of the template having the micro-pattern for transfer formed therein is shaped to have a rectangular planar shape; by arranging the first part, the third part and the second part in a straight line, a micro-pattern is formed within a rectangular area; the position relation detecting step is a step of detecting, on one side in a width direction of the rectangular micro-pattern, a positional deviation of the transfer pattern on the template relative to the first part at the boundary between the first part and the transfer micro-pattern formed on the template. the template relative to the second part at the boundary between the second part and the transfer pattern formed on the template, and by detecting, on the other side in the width direction of the rectangular micro-pattern, a positional deviation of the transfer pattern on the template relative to the first part at the boundary between the first part and the transfer pattern formed on the template; and the correction step is a step of performing the correction by compensating the dimensions of the template in the width direction by changing an elastic deformation portion of the template in the width direction of the rectangular micropattern by using an actuator based on the deviation in position on the other side in the width direction.
[22] A ninth aspect of the present invention is a stamp made by electroforming using a substrate that includes a micro-pattern formed using the micro-pattern forming method according to any one of the first to fourth aspects.
[23] A tenth aspect of the present invention is a template formed using a substrate that includes a micro-pattern formed by using the micro-pattern forming method according to any one of the first to the fourth aspects, in which a portion of the template having the micro-pattern formed therein is shaped to be elongate by performing the transfer steps and the forming steps of micro-patterns which are aligned with each other.
[24] An eleventh aspect of the present invention is a transfer method for transferring the micro-pattern on the stamp according to the tenth aspect to an object-to-be-formed, in which part of the stamp having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder, or the part of the piston having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder in such a way that the longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder, and the transfer is carried out during a displacement of a linear pressing part of the convex surface against the object-to-be-formed from one to the other. other end of the convex surface.
[25] A twelfth aspect of the present invention is a transfer method according to the eleventh aspect, in which, when the first transfer is performed, the stamp for a second transfer in the transfer method according to the ninth aspect, the micro-pattern on the stamp is transferred to the object-to-be-formed in a manner coupled in the width direction.
[26] A thirteenth aspect of the present invention is a micropattern forming method for continuously forming a micromattern on the object-to-be-formed, each micropattern corresponding to the micromattern formed on the stamp according to the tenth aspect, the method including: a first ( third) covering step of covering a surface of the object-to-be-formed with a layer of a transfer material; a first (fourth) transfer step for transferring the micro-pattern for transfer to the transfer material, which is formed in the first (third) covering step by pressing the star pile against the object-to-be formed with the layer of the transfer material provided on its surface by the first 534 274 10 (third) the coverage step; a first (third or fourth) step of forming a micro-pattern to form a micro-pattern on the object-to-be formed by etching after the transfer of the micro-pattern through the first (fourth) transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the stamp; a first (third or fourth) removal step for removing the transfer material, which is provided in the first (third) coverage step after the formation of the micro-pattern by the first (third or fourth) step of forming the micro-pattern; a second (fourth) covering step for covering the surface of the object-to-be-formed with a layer of the transfer material after removal of the transfer material in the first (third or fourth) removal step; a second (fifth) transfer step for transferring the micro-pattern prior to transfer to the transfer material, which is formed in the second covering step by pressing the stamp against the object-to-be formed having the layer with the transfer material provided on its surface through the second (fourth) covering step; a second (fourth or fifth) step for forming a micro-pattern to form a micro-pattern on the object-to-be-formed by etching after the transfer of the micro-pattern through the second (fifth) transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the stamp; and a second (fourth or fifth) removal step for removing the transfer material, which is provided in the second covering step after the formation of the micro-pattern by the second (fourth or fifth) step for forming micro-patterns.
[27] A fourteenth aspect of the present invention is the method of forming a micron pattern according to the thirteenth aspect, in which, in each of the transfer steps, the part of the stamp having the micron pattern formed therein is formed into a convex surface shape using a portion of a lateral surface. of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder, or the part of the piston having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder on a such that the longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder, and the transfer is performed while a linear pressing part of the convex surface is moved towards the object-to-be formed from one end to the other end of the convex surface.
[28] A fifteenth aspect of the present invention is the micropattern forming method according to any one of the first to fourth aspects, in which micropattern is formed in parts of the substrate corresponding to parts of a color of a grid pattern in the first transfer step and the first step. for forming micro-patterns, and micro-patterns are formed in parts of the substrate corresponding to parts of the second color of the grid pattern in the second transfer step and the second step for forming micro-patterns.
[29] A sixteenth aspect of the present invention is a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on a template, wherein the micro-pattern forming method includes: a coating step for covering a surface of the substrate with a layer of a transfer material; a transfer step of transferring the micro-patterns for transfer at predetermined intervals at a plurality of points on the transfer material formed in the covering step by pressing the template more than once against the substrate having the layer of transfer material provided on its surface through the covering step; a step of forming micro-patterns to form the micro-patterns at predetermined intervals at a number of points on the substrate by etching, after the transfer of the micro-patterns through the transfer step, which micro-patterns each correspond to the micro-pattern for transfer to the template; and a removal step for removing the transfer material provided in the covering step after forming the micro-patterns by the step of forming micro-patterns, in which, each of the micro-patterns corresponding to the micro-pattern for transfer formed on the template is continuously formed on the substrate by repeating a cycle of , the transfer step, the micro-pattern forming step and the removal step in this order several times.
[30] A seventeenth aspect of the present invention is a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on a template, wherein the micro-pattern forming method includes: a coating step for covering a surface of a lower transfer material on the substrate with a layer of an upper transfer material, the surface of the substrate being covered with a layer of the lower transfer material; a transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the upper transfer material formed in the covering step by pressing the template more than once against the substrate with the layer of the upper transfer material provided on its surface by covering; a step of forming micro-patterns to form the micro-pattern at predetermined intervals at a number of points on the lower transfer material by etching, after the transfer of the micro-patterns through the transfer step, the micro-patterns each corresponding to the micro-pattern for transfer to the template; and a removal step for removing the transfer material provided in the covering step after the formation of the micro-patterns by the step of forming micro-patterns, in which, the micro-patterns each corresponding to the micro-pattern for transfer formed on the template are continuously formed on the lower transfer material by repeating a micro-pattern. , the transfer step, the step of forming micro-patterns and the removal step in this order several times, a new chromo pattern corresponding to the micro-patterns of the lower transfer material is formed on the substrate by etching, after the formation of the micro-patterns on the lower transfer material, and the micro-patterns formed on the template is continuously formed on the substrate by removing the lower transfer material, after the formation of the micro-pattern on the substrate.
[31] An eighteenth aspect of the present invention is a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on a template, wherein the micro-pattern forming method includes: a covering step for covering a surface of a third material on the substrate with a layer of a transfer material, the substrate being formed by stacking a first material, a layer-like second material and a layer-like third material; a transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the transfer material formed in the covering step by pressing the template more than once against the substrate with the layer of the transfer material provided on its surface through the covering step; a step of forming micro-patterns to form the micro-pattern at predetermined intervals at a number of points on the third material by etching, after the transfer of the micro-patterns through the transfer step, the micro-patterns each corresponding to the micro-pattern for transfer to the template; and a removal step for removing the transfer material, which is provided in the covering step after the formation of the micro-patterns by the step of forming micro-patterns, in which, the micro-patterns each corresponding to the micro-pattern for transfer formed on the template are continuously formed on the substrate by repeating a cycle of covering , the transfer step, the micro-pattern forming step and the removal step in this order several times.
[32] A nineteenth aspect of the present invention is a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on a template, wherein the micro-pattern forming method includes: a covering step for covering a surface of the substrate with a layer of a transfer material; a transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the transfer material formed in the covering step by pressing the template more than once against the substrate with the layer of the transfer material provided on its surface through the covering step; a providing step for providing a cover member on a portion where the substrate is exposed by the transmission of the micro-pattern for transfer in the transfer step; and a removal step for removing the transfer material provided in the covering step after covering the part where the substrate is exposed with the covering elements in the providing step, in which, the micro-pattern corresponding to the micro-pattern for transfer to the template is formed by etching, after repeating the respective steps in the covering step, the transfer step, the supply step and the removal step, and the micro-patterns corresponding to the micro-pattern for transfer formed on the template are continuously formed on the substrate by removing the cover elements provided in the supply step after the formation of the micro-pattern.
[33] According to the first to nineteenth aspects of the present invention, an effect is obtained where micro-patterns with a precise shape can be formed on the substrate in the micro-pattern forming method to continuously form micro-patterns on the substrate, where the micro-patterns each correspond to the micro-pattern for transfer formed on the template. . 534 274 14 Description of the fl gures [Fig. Fig. 1 is a front view showing a schematic configuration of a transfer device.
[35] With reference to the figures, embodiments of the present invention will be described below.
[36] [First Embodiment] Fig. 3 is a view schematically showing the steps of a micro-pattern forming method according to a first embodiment of the present invention.
[37] The micropattern forming method is to continuously form, on a flat surface of a substrate W1, micropattern (the same micropattern as a template (stamp or embosser) M1) which each corresponds to a micropattern for transfer (fl number of extremely convex and concave structures) formed on the template M1 by transmitting the pattern in a divided manner. An area (for example, an area of the planar surface) of the substrate W1 on which the micro-pattern is to be formed is larger than the area of the template M1 on which the micro-pattern for transfer is formed. Note that the template M1 is made of, for example, quartz glass, and the micro-pattern for transfer is formed on a flat surface of the template M1.
[38] Thereafter, the flat surface of the template M1 with the micro-pattern for transfer formed thereon is to be pressed against a portion of the substrate W1 with the thin layer of the transfer material W2 provided on its surface. Thus, the micro-pattern for transfer on the template M1 is transferred to the thin layer of transfer material W2 (see Fig. 3 (a)). In this transfer, the transfer material W2 is cured by light irradiation of the transfer material with ultraviolet light.
[39] Note that the transfer shown in Fig. 3 (a) is performed, for example, more than once, but can also be performed only once. In Fig. 3 (a), when the template M1 is located at PS1, the template is lowered as indicated by an arrow AR1 to perform the first transfer. Then, the template is moved as indicated by an arrow AR2 and, when the template M 1 is placed at PS2, the template M 1 is lowered as indicated by an arrow ARS, to perform the second transfer.
[40] Furthermore, in the transfer shown in Fig. 3 (a), the ultraviolet light irradiation performed in the first transfer (transfer at PS1) allows the transfer material W2 to cure only at a part of the transfer material W2 where a micro-pattern is formed in the first transfer and in an adjacent part.
[41] In addition, the first transfer (the transfer at PS1) and the second transfer (the transfer at PS2) are performed in a predetermined interval. For example, by performing the transfer in a subsequent step as shown in Fig. 3 (c) at a position between the first transfer (transfer at PS1) and the second transfer (transfer at PS2), a continuously coupled micro-pattern is formed on the substrate Wl.
[42] In addition, after the transfer shown in Fig. 3 (a) is performed, very thin layers of transfer material (not shown) are formed in extremely concave portions of W2a of the transfer material W2, which are formed by extremely fma convex portions of the micro-pattern for transfer on the template M 1. In other words, at the lower parts of the extremely concave parts W2a of the transfer material W2, the substrate W1 is covered with a very thin layer of the transfer material W2.
[43] After the transfer shown in Fig. 3 (a) is performed and the micro-pattern of the transfer material W2 has been formed, the template M1 is moved away from the substrate W1 and the transfer material W2. Thereafter, a remaining layer is removed in the same manner as in the case shown in Figs. 24 (c) and 24 (d). In particular, the very thin layer of transfer material W2 covering the substrate W1 is removed at the extremely concave part W2a of the transfer material by using an O2 plasma or the like. Thus, the surface of the substrate W1 as shown in Fig. 3 (a) is exposed with the same micro-pattern as the micro-pattern for transfer on the template M1.
[44] After removal of the remaining layer, by etching (for example dry etching) the substrate W1 using the transfer material W2 as a mesh material, a micro-pattern corresponding to the micro-pattern is formed before transfer to the template M1 on the substrate W1. In particular, a micro-pattern corresponding to the micro-pattern of the transfer material W2, as shown in Fig. 3 (a), is formed on the substrate W1.
[45] Note that the transfer material W2 remains intact even after the etching.
[46] 534 274 18 After the micron pattern is formed on the substrate W1, the transfer material W2 shown in Fig. 3 (a) is removed (washed) with a solution which dissolves only the transfer material W2 without dissolving the substrate W1 (see Fig. 3). (b)).
[47] After the transfer material W2 is removed, the surface parts of the substrate W1 where the micro-pattern is formed and other surface parts (parts where no micro-pattern is formed) of the substrate W1, where the other surface parts are connected to the above parts, are covered with a thin layer of the transfer material W2. . For example, substantially the entire flat surface on one side in the thickness direction of the substrate W1 is covered with the transfer material W2 in the same manner as in the case shown in Fig. 3 (a). Then, in substantially the same manner as in the case shown in Fig. 3 (a), the template M1 is pressed against another part continuously coupled to the part where the micro-pattern is formed as shown in Fig. 3 (b), where the part which is pressed against the template M1 is a portion of the substrate W1 and has the thin layer of transfer material W2 provided on its surface. Thereafter, ultraviolet light irradiation is performed to transmit the micro-pattern for transmission to the transmission material W2 (see Fig. 3 (c)).
[49] Note that the template used in the transmission in Fig. 3 (c) and the template used in the transmission in Fig. 3 (a) are the same template. However, the template used in the transmission in Fig. 3 (c) and the template used in the transmission in Fig. 3 (a) may be different.
[50] After the micron pattern is transferred to the transfer material W2, as shown in Fig. 3 (c), the template M1 is moved away from the substrate W1 and the transfer material W2, and the remaining layer is removed, and then the same etching is performed as described above on the substrate W1. . Thus, a micro-pattern is formed which corresponds to the micro-pattern for transfer on the template M1, and which is continuously coupled to the micro-patterns shown in Fig. 3 (b) (similar to the micro-patterns obtained by »continuously coupling the micro-pattern for transfer on the template M1) on the substrate W1.
[51] After the continuously coupled micro-patterns are formed on substrate W1, the transfer material W2, which is provided in the step shown in Fig. 3 (c), is removed with the solvent which only dissolves the transfer material W2 without dissolving the substrate W1 (see Fig. 3). (d)). 534 274 19
[52] The substrate W1 with the micro-pattern thus formed thereon is used for manufacturing an electroformed template, a replica of a layer or the like. In particular, a nickel template is manufactured by an electroforming process for nickel based on the substrate W1, with the micro-pattern formed thereon. Alternatively, a micro-pattern is transferred to a resin by using the substrate W1 having the micro-pattern formed thereon to make a resin replica such as a plastic resin and an ultraviolet light curable resin. Thereafter, the nickel needle is made from the resin replica by the electroforming process for nickel. This nickel template includes a nickel pattern (same micro-pattern as that on the substrate W1) corresponding to the micro-pattern formed on the substrate W1.
[53] Using the nickel template, the transfer of the micro-pattern to a resin substrate is performed continuously once or fl once more. Thus, an optical element is generated for a display, a line grid polarizer, a photonic crystal and an antirectrating structure.
[54] Note that the continuously coupled micro-patterns shown in Fig. 3 (d) are formed on the substrate W1 in such a manner that a portion (an end portion in a horizontal direction in Figs. 3 (a) and 3 (b)) of the micro-pattern formed on the transfer material W2 and the substrate W1 shown in Figs. 3 (a) and 3 (b) and a portion (a spirit portion in a horizontal direction in Figs. 3 (c) and 3 (d)) of the micro-pattern formed on the transfer material W2 and the substrate W1 shown in Figs. 3 (c) and 3 (d) overlap (by, for example, approximately 100 μm to 500 μm). However, such an overlap is not always necessary. In particular, the end portion of the micro-pattern formed on the transfer material W2 and the substrate W1 shown in Figs. 3 (a) and 3 (b) and the end portion of the micro-pattern formed on the transfer material W2 and the substrate W1 shown in Figs. 3 (c) and 3 ( d) be adjacent, or slightly separated, from each other without overlapping.
[55] The micro-pattern formed on the substrate W1 in the steps shown in Fig. 3 is extended in a direction (a width direction of the substrate W1) perpendicular to a longitudinal direction of the substrate W1 as shown in Fig. 4 (a). However, a substrate (similar to a substrate W3 shown in Fig. 5) W1a having a micro-pattern extending in a longitudinal direction of the substrate W1 shown in Fig. 4 (b) can be manufactured, for example, by changing a mounting position. of the template M1.
[56] In a coupling between micro-patterns (a coupling between micro-patterns formed in the steps of Figs. 3 (a) and 3 (b) and the micro-patterns formed in the steps of Figs. 3 (c) and 3 (d)) on the substrate W1a which shown in Fig. 4 (b), small steps W3a are found as in the case of the substrate W3 as shown in Fig. 5. However, these steps W3a do not cause any practical problems.
[57] Here, a description of the transfer device 1 for performing the steps in Figs. 3 (a) and 3 (c) will be given.
[58] Fig. 1 is a front view showing a schematic configuration of the transfer device 1. Fig. 2 is a side view showing the schematic configuration of the transfer device 1 and is a view seen from an arrow II in Fig. 1.
[59] In the following, for the sake of simplicity, it is assumed that one direction in a horizontal direction is an X-axis direction, and that another direction in the horizontal direction which is perpendicular to the X-axis direction is a Y-axis direction, and that a direction (an upper and a lower direction or a vertical direction) perpendicular to the X-axis direction and the Y-axis direction is a Z-axis direction.
[60] The transfer device 1 is a device which transfers micro-patterns formed on a surface (for example, a flat lower surface) of a moulder (template) M1 to a surface (for example, a flat upper surface) of the transfer material W2 on the substrate W1 by allowing the surface of the embosser M1 to come into contact with the surface of the transfer material W2 and pressing the embosser M1 as required.
[61] The transfer device 1 includes a base body 3. A substrate holder 5 is provided in the base body 3 to hold the substrate W1. The substrate holder 5 has, for example, a flat upper surface on which the substrate W1 having the thin transfer material W2 provided thereon can be mounted and held.
[62] The substrate holder 5 is supported by the base body 3 through an XYG platform 7. Therefore, the substrate holder 5 (the substrate W1) is freely surfaceable and positionable in the X-axis and Y-axis directions and also freely rotatable and positionable about an axis parallel to Z shaft by driving an actuator (not shown), such as a servomotor included in the XYG platform 7, which is controlled by a control device (not shown).
[63] In the base body 3, a stamp holder (template holder) 9 is provided.
[64] The piston holder 9 is supported by the base body 3 through an unillustrated guide bearing and is freely displaceable and positionable in the Z-axis direction by driving an actuator (not shown), such as a servomotor controlled by a control device.
[65] Furthermore, in the transfer device 1, a UV light generator (not shown) is provided for light irradiating the substrate W1 (the transfer material W2) with UV light. Thus, in forming the micro-pattern on the transfer material W2, the transfer material W2 created by the ultraviolet light curable resin can be cured.
[66] Note that, as transfer material W2, a thermoplastic resin or a thermosetting resin can be selected instead of the ultraviolet light curable resin. In this case, a heater device (not shown) is provided for heating the substrate W1 (the transfer material W2) in the transfer device 1. Furthermore, as the substrate W1, a glass substrate can be selected instead of a silicon substrate. In addition, as the material for the template M1, silicon, metal such as nickel, glassy carbon or lilac can be chosen instead of quartz glass.
[67] Furthermore, a position relation detecting device 11 and a correction device 13 are provided in the transmission device 1.
[68] The position relation detecting device 11 is a device as follows. After the micropattern is formed on the substrate W1 by a first group of single or multiple transfers and etchings as shown in Figs. 3 (a) and 3 (b), and before a second group of single or multiple transfers is performed as shown in Fig. 3 (c), the position relation detecting device 11 detects a position relation between a micro-pattern formed on the substrate W1 by the first group of multiple transmissions (pressing of the transfer material W2 with the template M1) and a micro-pattern for transmission formed on the template (the template which is in position to perform the second group of transfers in the X and Y axis directions and not in contact with the substrate W1 and the transfer material W2 in the Z axis direction, for example, with the template positioned at PS3 or PS4 in Fig. 3 (c)) M1.
[69] The correction device 13 is a device which corrects the position of the template M1 relative to the substrate W1 based on a result of the detection of the position relation detecting device 11, in such a way that the micro pattern for transmission, which is formed by the second group of transmissions and etchings, precisely can be coupled to the micro-pattern formed on the substrate W1 by the first group of transfers and etchings. Note that this correction is performed, for example, when the template M1 is positioned at PS3 and PS4 in the position shown in Fig. 3 (c).
[70] The position relation detecting device 11, the correction device 13 and the like will be described in more detail by giving examples. Fig. 6 is a view showing an installation condition of the template M1 of the stamp holder 9 and a camera (for example a CCD camera) included in the position relation detecting device 1 1.
[72] In a central portion of the piston holder 9, a hole 23 penetrating in the Z-axis direction is provided. The flat plate template M1 is provided to cover a lower end portion of the hole 23. The ultraviolet light generated by the UV light generator passes through the hole 23, is transmitted through the template M1 and reaches the transfer material W2. The side surfaces of the template M1 are supported by a template supporting device 17. In addition, an end portion of the side surfaces is pressed through a shoe 16 with an actuator 21 as a piezoelectric element. Thus, the template M1 is biased upward and provided integrated with the stamp holder 9. Note that when the template M1 does not transmit the ultraviolet light, ultraviolet light irradiation is performed, for example, through the substrate holder 5.
[73] In Fig. 6, to simplify the description, the template M1 is pressed (compressed) in the X-axis direction of the actuator 21. However, the template M1 is in fact compressed in the Y-axis direction of the actuator 21. Furthermore, in Fig. 6 and 7, the transfer and the like are performed continuously in the X-axis direction to form micro-patterns continuously coupled in the X-axis direction on the substrate W1 as shown in Figs. 4 (b) and 5.
[74] Furthermore, for the template M1 compressed in the Y-axis direction of the actuator 21, its dimension in the Y-axis direction DY1 is in a normal state, as shown in Fig. 10.
[75] The position relation detecting device 11 includes the camera 25 as described above. The camera 25 is provided integrated with the stamp holder 9 inside the hole 23 in the stamp holder 9 by using, for example, a bracket not illustrated. The camera 25 is capable of observing the substrate W1 through the template M1. To be more precise, the camera 25 is capable of observing a connection between one of the first group of transmissions TR1 and one of the second group of transmissions TR2, which is performed continuously with said one of the first group of transmissions TR1.
[76] More specifically, as shown in Fig. 7 (a), assuming that a micro-pattern is formed on the substrate by a first transfer TR1a of the first group and a micro-pattern is formed on the substrate by a second transfer TR1b of the first group, it is possible for the camera 25 to observe parts of the connections between the second group of transmissions TR2 to be performed and the micro-patterns TR1a and TR1b and a part around them (parts P1 to P3 shown in Fig. 7 (a)).
[77] In the case where the part P1 is observed, for example, light intensities can be detected along a line A, a line B (overlapping part) and a line C shown in Fig. 7 (b). In the case of trying to produce the substrate W1a with the micro-pattern, as shown in Fig. 4 (b) or Fig. 5, the light intensities detected along line A to C are as shown in Fig. 8.
[78] Each of the light intensities along lines A to C is in a rectangular waveform in a normal state shown in Fig. 8 (a). However, when a position of a micro-pattern (transmission pattern on the template M1) to be formed is offset relative to the micro-pattern TR1a by, for example, AY as shown in Fig. 8 (b), the light intensity along line A and the light intensity along line C will approximately coincide. Thus, the light intensity along line B does not have a uniform single-stage rectangular waveform, but a two-stage rectangular waveform.
[79] Note that parts P2 and P3 are approximately the same as the case of part P1.
[80] When it has been detected that the light intensities P1 and P2, based on a signal received from the camera 25, do not have a rectangular shape as shown in Fig. 8 (b), the control unit accordingly checks the XY G platform 7 to the correct position. on the substrate W1 relative to the template M1 so that the light intensities in the parts P1 and P2 have the rectangular shape shown in Fig. 8 (a).
[81] Furthermore, when it is detected, based on a signal received from the camera 25, that the light intensity in the part P3 does not have the rectangular shape shown in Fig. 8 (b), the control device controls the voltage applied to the piezoelectric element 2 1 so that it approximately compensates for the template M1 in the Y-axis direction.
[82] Incidentally, the position relation detecting device 11 may have a different configuration. 534 274 25
[83] In particular, in the transfer device 1 shown in Fig. 1, the position relation detecting device 11 may include a thin plate-like detector 15. A thickness direction of the detector 15 is the Z-axis direction. Furthermore, the position relation detecting device 11 may be configured to detect a position deviating portion of the substrate W1 (the transfer material W2) relative to the template M1 by inserting the detector 15 between the template M1 and the substrate W1 (the transfer material W2) before the transfer is performed.
[84] In the case where the detector 15 is inserted between the template M1 and the substrate W1 (the transfer material W2) to detect the position deviating portion, it is preferable that the detector 15 is inserted between the template M1 and the substrate W1 (the transfer material W2) to a state when there is hardly any dimensional play at all because the template M1 and the substrate W1 (the transfer material W2) come as close to each other as possible.
[85] For example, in the case where the detector 15 is inserted between the template M1 and the substrate W1 (the transfer material W2) to detect the deviation in position, it is preferable that a distance L3 between the detector 15 and the template M1 is approximately 0.5 mm to 3 mm and that the distance L5 between the detector 15 and the transmission material W2 is also approximately 0.5 mm to 3 mm. Furthermore, it is preferred that a thickness (dimension in the Z-axis direction) of the detector 15 be minimized at least in a part positioned between the template M1 and the substrate W1 (the transfer material W2).
[86] The position relation detecting device 11 will be described in more detail by giving examples.
[87] The detector 15 in the position relation detecting device (detecting device for position deviation) 11 is removable between a first position (see detector 15 indicated by a solid line in Fig. 1) where detector 15 is inserted between the template M1 and the substrate W1 (the transfer material W2). when the template M1 and the substrate W1 (the transfer material W2) are separated from each other by a predetermined distance and a second position (see detector 15 indicated by a double-stretched chain line in Fig. 1) separated from the template M1 and the substrate W1 534 274 26 (the transfer material W2) , which enables the template M1 and the substrate W1 (the transfer material W2) to come into contact with each other. In this case, the detector 15 is integrally provided with a first detector supporting element 29 at a top portion of the first detector supporting element 29. The first detector supporting element 29 is provided to a second detector supporting element 31 through a linear guide bearing (not shown) to thus being displaceable relative to the second detector supporting element 31 in the X-axis direction. Further, under the control of the control unit, the detector 15 is moved between the first position (position indicated by the solid line in Fig. 1) where the detector is inserted between the template and the substrate and the second position (position indicated by the double-stranded chain line in Fig. 1) separated from the template and substrate by an actuator (not shown) such as a pneumatic cylinder.
[89] The second detector supporting element 31 is provided to the base body 3 by a linear guide bearing (not shown) so as to be displaceable in the Z-axis direction relative to the base body 3. Furthermore, the second detector supporting element 31 is freely displaceable and positionable in a vertical direction. through an actuator (not shown) such as a servomotor and a ball screw (not shown] under the control of the control unit.
[90] Therefore, the position of the detector 15 can be adjusted in the Z-axis direction according to the configurations of the template M1 and the substrate W1 (the transfer material W2).
[91] More specifically, the position relation detecting device 11 includes a camera (not shown). The camera is provided in a position separated from the detector 15 (for example in the first detector supporting element 29). In addition, a prism (not shown) is provided in the detector 15. The position relation detecting device 11 is configured to detect a position deviation on the substrate W1 (the transfer material W2) or the template M1 by using the camera through the prism. In particular, light traveling in the Z-axis direction from the substrate W1 (the transfer material W2) or the template M1 is reflected by the prism so that it travels in the X-axis direction, for example. The camera captures the reflected light.
[92] The configuration where the detector 15 is used as described above enables the detection of a position deviation on the substrate W1 (the transfer material W2) or the template M1 even when the template M1 is made of metal or the like and is not transparent.
[93] Thus, in the step of forming the micro-pattern on the substrate W1, as shown in Fig. 3, a positional relationship between a micro-pattern formed on the substrate W1 by the first group of transmissions and the like, and a micro-pattern for transfer, which is formed, is detected. on the template M1 before performing the second group of transmissions, by using the detector 15 and the like in the position relation detecting device 11 after the micro-pattern is formed on the substrate W1 by the first group of transmissions and the like shown in Fig. 3 (b) and before the second group of transmissions is performed, as in the case of using the camera 25 described above and the like. More specifically, the relationship in position between the micro-pattern formed on the substrate W1 and the micro-pattern formed on the template in the state shown in Fig. 3 (c) is detected.
[94] Further, the correction device 13 corrects a position of the template M1 relative to the substrate W1 based on a detection result of the relation in position, to precisely couple the micro-pattern for transfer to be formed in the second step of forming micro-patterns to the micro-pattern formed on the substrate W1 by first group of transfers and the like. In particular, a relative positional relationship between the substrate W1 and the template M1 in the state shown in Fig. 3 (c) is set to be accurate.
[95] Furthermore, in the correction of the position of the template M1 relative to the substrate W1 by controlling the actuator 21 in the transfer device 1, for example, a change in shape of the template M1 due to a temperature change is obtained to achieve an exact shape of the template M1.
[96] In this case, with reference to Fig. 7, a more detailed description of the correction and the like in the step of forming the micro-pattern on the substrate W1 shown in Fig. 3 will be given by showing examples.
[97] First, through the first group of transfer steps and steps for forming micro-patterns, micro-patterns are formed in a first part TR1a of the transfer material W2 and in a second part TR1b separated from the first part TR1a by a predetermined distance.
[98] Thereafter, a micro-pattern is formed in a third part TR2 between the first and second parts TR1a and TR1b through the second group of transfer steps and steps for forming micro-patterns, the third part TR2 continuously connecting the first and second parts TR1a and TR1b.
[99] In this case, as described above, the position relation detecting device 11 detects a position deviation of a micro-pattern for transmission formed on the template M1 relative to the first part TR1a at a boundary line between the first part TR1a and the micro-pattern for transmission on the template M1 and a position deviation. for the micro-pattern formed on the template M1 relative to the second part TR1b at a boundary line between the second part TR1b and the micro-pattern for transfer on the template M1.
[100] More specifically, the part of the template M1 with the micro-pattern for transfer formed thereon is formed into a rectangular planar shape. By arranging the first part TR1a, the third part TR2 and the second part TR1b in a straight line, a micro-pattern is formed within a rectangular area. The position relation detecting device 11 detects, on the one hand in a width direction of the rectangular micro-pattern, a relative position deviation (the deviating proportion in position of the micro-pattern for transmission on the template M1 relative to the first part TR1a) in the part P1 at the boundary line between the first part 534 274 29 TR1a and the micro-pattern for transmission formed on the template M1 and a relative position deviation (the position deviation of the micro-pattern for transmission on the template M1 relative to the first part TR1b) in part P2 at the boundary line between the second part TR1b and the micro-pattern for transmission formed on the template M1 .
[102] Furthermore, the position relation detecting device 11 detects, on the other hand, in a width direction of the rectangular micro-pattern, a relative position deviation (the position deviation of the micro-pattern for transmission on the template M1 relative to the first part TR1b) in the part P3 at the boundary line between the second part TR1b (or the first part TR1a) and the micro-pattern for transmission formed on the template M1.
[103] The correction device 13 compensates the position and condition of the substrate W1 by using XYO platform 7 based on the position deviation on one side (parts P1 and P2) in a width direction and the position deviation on the other side (part P3) in a width direction. Furthermore, the correction device 13 also compensates for the dimension of the template M1 in the width direction by using the actuator 21 to change an elastic deformation proportion of the template M1 in the width direction in the rectangular micro-pattern.
[106] Furthermore, in the above description, the position relation is detected by comparing the position of the micro-pattern formed on the substrate W1 with the position of the micro-pattern on the template M1. However, markings can be placed on the substrate W1 and the template M1, and these markings are photographed with a camera or the like to detect a positional relationship and thereby perform a correction.
[108] When a micro-pattern is formed by performing a first group of transfers TR] on a substrate W4, the marks MW1 to MW4 corresponding to the marks MM1 to MM4 on the template M1 are placed on the substrate W4 together with the micro-pattern. Then, in performing a second group of transfers TR2, a positional deviation between the markings MW2 and MW4 on the substrate W4 and the markings MM1 and MM3 on the template M1 is detected. Thus, a position deviation on the template M1 (substrate W4) can be corrected when a second group of transfers TR2 is to be performed relative to the position of the first group of transfers TR1.
[109] Furthermore, as shown in Fig. 9 (b), the labels MW6 to MW11 can be placed on the substrate W4a before a micro-pattern for transfer is formed. Note that the micro-pattern for transmission is formed in an area TRS1 within the markings MW6 to MW11.
[111] Furthermore, in the case shown in Fig. 9 (b), a position deviation on the template M1 (substrate W4a) can be corrected by providing markings also on the template M1 and detecting position deviating proportions between the markings previously provided on the substrate W4a and the markings provided on template M 1.
[114] Furthermore, when the transfer is performed using the stamp M3, it is preferable to perform the transfer as follows. As shown in Fig. 14, a part (surface) of the stamp M3 having the micro-pattern formed thereon is formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that the longitudinal direction of the part is set as a peripheral direction of the cylinder and a width direction of the surface are set as a height direction of the cylinder. Furthermore, the transfer is performed by superimposing a linear pressing part (extending in a direction perpendicular to the side plane in Fig. 14) of the convex surface pressed against the object-to-be formed W5 (the layer-to-be formed W6) from one the end to the other end of the convex surface in its longitudinal direction (for example, by moving the linear pressing member from the end of the left side to the end of the right side in Fig. 14).
[120] The transfer device 1a will now be described in detail. Between a substrate carrier (substrate table) 5 and a displaceable element 19 (equivalent to the stamp carrier 9 in the transfer device 1), the stamp carrier 51 is provided.
[121] The convex surface 53 is formed using a portion of a lateral surface of a cylinder. Note that the cylinder does not have to have a completely cylindrical shape, for example, an elliptical cylindrical shape. Furthermore, the convex surface 53 can be formed by using a portion of a lateral surface of a columnar solid body (a solid body formed by a path of a plane having a predetermined shape, such as a circle and an ellipse, when the plane of the predetermined shape for fl a predetermined distance is flattened in a direction perpendicular to the plane).
[122] The convex surface 53 of the stamp carrier 51 will now be described in more detail. The convex surface 53 has the shape of a small surface area among four surfaces (two large area surfaces and two small area surfaces) obtained by dividing the lateral surface of the cylinder by a first plane including a central axis (extending in a height direction of the cylinder) of the cylinder and a second plane which includes the central axis of the cylinder and intersects the first plane at a small angle.
[123] Note that the convex surface 53 has a shape near that of a plane because the diameter of the cylinder is large and the cutting angle is small. Assuming that an extended axial direction (direction perpendicular to the disk surface in Fig. 2) of the central axis of cylinder is a longitudinal direction of the convex surface 53 and a peripheral direction (approximately a horizontal direction in Fig. 15) of the lateral surface of the cylinder. is a width direction of the convex surface 53, a center portion of the convex surface 53 protrudes only about 0.1 mm (T) to a width B of 300 mm, for example, as shown in Fig. 15.
[124] Accordingly, the cylinder has a large radius so that the proportion of a protruding portion T of the center position of the convex surface 53 to the width B of the convex surface 53 is, for example, "1/100000 to 1/3000". In particular, the radius of the cylinder has a value as large as 125 to 2750 times the width B of the convex surface 53.
[125] Furthermore, it is possible for a stamp 55 (Stamp M3) for transfer to follow the convex surface 53 and can, for example, be retained by vacuum adsorption. The stamp 534 274 34 55 years is formed by Ni electroforming, as described above, in the form of a thin rectangular flat plate. An ultra-micro pattern for transmission is formed on one side (a lower side in Fig. 15) of the stamp 55.
[126] Note that the radius of the cylinder may be such that a ratio of the protruding portion T of the center portion of the convex surface 53 to the width of the convex surface 53 is "1/3000 to 1/30". In other words, the radius of the cylinder may have a value of 3 to 125 times the width B of the convex surface 53. For example, when the width B of the convex surface 53 is 300 mm, the protruding portion T may be increased to about 10 mm.
[127] Furthermore, the piston holder 51 is supported by the movable element 19 through a movable element 57 and movable relative to the substrate carrier 5 in a direction (vertical direction, Z-axis direction] which allows it to reach and be separated from the substrate carrier 5 in accordance with the liner surface. of the movable element 19.
[128] Note that although the punch carrier 51 and the punch 55 are separated from each other in the above description, the punch carrier 51 and the punch 55 may be integrated with each other. In other words, a transfer pattern can be provided directly on the convex surface 53 of the piston carrier 51.
[129] Furthermore, a pressing device 59 is provided in the transfer device 1a. The pressing device 59 is used to enable the stamp 55 supported by the stamp holder 51 to come close to the object-to-be formed W5 (the layer-to-be formed W6) retained by the substrate carrier 5, and to press the object-to-be formed W5 (layer-to-be-formed W6) with the stamp 55 and thus transfer a transfer pattern on the stamp 55 to the layer-to-be-formed W6 on the object-to-be-formed W5.
[130] The pressing device 59 is configured to press the object-to-be-formed W5 (layer-to-be-formed W6) with the punch 55 by moving a linear pressing part parallel to the center axis of the cylinder from one end to the other end of the convex surface 53 (from the left side to the right side in Fig. 15).
[133] The transfer device 1a will now be described in more detail.
[134] Below the movable element 19, the second movable element S7 is provided.
[135] On the inside (upper side in Fig. 15, the side where an un illustrated center axis of the cylinder exists relative to the convex surface 53) of the convex surface 53 of the piston holder 51 and in an intermediate part (for example approximately in a center part in X axis direction) of the convex surface 53, a pivoting center axis CL1 is provided. This pivoting center axis CL1 is a straight line extending in the Y-axis direction. The piston holder 51 is supported in such a way that it is pivotable against the movable element 57 about the pivoting center axis CL1.
[139] Between the piston carrier 51 and the extensible element 57, a biasing device and an actuator are provided. The biasing device is formed by, for example, a disc spring 67 provided on the left side in Fig. 15.
[140] Note that an actuator such as a motor can be used instead of the piezoelectric element. More specifically, the piston holder 51 can be pivoted by using a servomotor to rotate a nut of a ball screw, thereby linearly to surface a threaded shaft of the ball screw.
[141] In the case where the object-to-be-formed W5 (the-layer-to-be-formed W6) is pressed with the stamp 55 to perform a transfer to the object-to-be-formed W5 (the-layer-to-be-formed W6), the plunger 55 is first lifted to be separated from the object-to-be formed W5 (the layer-to-be-formed W6), and the piezoelectric element 69 is turned off (is fitted to a state when no voltage is applied to the same). Note that, in Fig. 15, a center portion 55B of the piston 55 is the lowest of the portions of the piston 55. However, in a position closed to the piezoelectric element 69, a left end (where the disc spring 67 is provided) 55A of the piston 55 becomes the lowest of the portions of the piston 55 by the biasing force of the disc spring 67.
[142] In the state where the left end 55A of the piston 55 is lowest as described above, the removable member 19 is lowered until the left end 55A of the piston 55 comes into contact with the object-to-be formed W5 (layer-as-is). 534 274 38 shall be formed W6) with a predetermined pressure. As a result, the piston 55 is placed in a position indicated by a double-dashed chain line in Fig. 15. In this, when the piezoelectric element 69 is turned on (voltage is applied thereto) and gradually stretched, the piston 55 (piston holder 51) pivots. Similarly, a contact position (a pressing position of the piston 55) between the piston 55 indicated by the double-dashed chain line in Fig. 15 and the object-to-be-formed W5 (the layer-to-be-formed W6) is moved from left to right in Figs. 15. Finally, a right end 55C of the piston 55 becomes the lowest and comes into contact with the object-to-be formed W5 (the layer-to-be-formed W6).
[145] By using a liquid pressure cylinder such as a pneumatic cylinder instead of the servomotor and controlling a pressure of a liquid supplied to the cylinder, the compression pressure of the piston 55 against the object-to-be formed W5 (the layer-to-be formed W6) can be maintained at a constant value as in the case of the feedback.
[147] Furthermore, as described above, the fl removable element 57 is moved in the X-axis direction to the fl removable element 19. Thus, when the object-to-be formed W5 (the layer-to-be formed W6) is pressed by lowering it for the removable member 19 and pivot the piston holder 51 (the piston 55) with the piezoelectric member 69, the removable member 57 is displaced away from the stopper 63 despite being pre-tracked by the spring 65. Thus, the position of the pivoting center shaft CL1 is slightly displaced relative to the object-to-be W5 (the layer-to-be-formed W6) is formed in a direction of movement (to the right in Fig. 15) of the pressing part.
[150] Under the substrate holder 5, a shutter 71 in the form of a plate is provided. In the shutter 71, a slot 73 is provided extending in the Y-axis direction. The slot 73 divides the shutter 71 into a right part 71A and a left part 71B as shown in Fig. 15.
[152] In the case where the shutter 71 is flush in synchronization with the flattening of the pressing member, the shutter 71, for example, is flattened according to the value of the voltage applied to the piezoelectric element 69.
[153] By using the transfer device 1a and the stamp M3 described above, the transfer to the layer-to-be-formed W6 and the formation of a micro-pattern on the object-to-be-formed WS can be performed in the same manner as in the case shown in Figs. 3. In this case, as shown in Fig. 13, a micro-pattern is formed in a part TR11 of the object-to-be formed W5 by a first group of transfers and the like, and the micro-pattern is formed in a part TR12 of the object-to-be shall-be formed W5 by a second group of transfers and the like. Thus, a micron pattern obtained by a two-dimensional expansion of the micro-pattern for transfer and originally formed on the template M1 is continuously formed on the object-to-be-formed W5 by the stamp M3.
[154] Incidentally, micro-patterns as shown in Fig. 12 can be formed using the steps shown in Fig. 3. In particular, micro-patterns are formed in parts (TR1 parts indicated by diagonal lines in Fig. 12) of the substrate W1, the parts corresponding to parts of a color of a grid pattern, through the first group of transmissions and the formation of micro-patterns. Furthermore, micro-patterns are formed in parts (TR2 parts shown in Fig. 12) of the substrate, where the parts correspond to the parts of the second color of the grid pattern, through the second group of transfers and formation of micro-patterns.
[155] When the micro-patterns are formed as described above, certain parts of the substrate W1 corresponding to the parts of a color of the grid pattern will be adjacent to each other. However, the parts are adjacent to each other at their corners, in other words, the parts are not in a line contact position but in a point contact position. Thus, even if the transfer material W2 swells due to the transfer, the swelling hardly has any effect. Consequently, precise transfer of the transfer material W2 can be performed. in
[156] Furthermore, as shown in Fig. 16, micropattern can be continuously formed on the substrate by multiple groups of steps, such as a third group of transmissions and formation of micropattern TR3, in addition to the first group of transmissions and formation of the micropattern TR1 as well as the the second group of transmissions and formation of the micro-patterns TR2.
[157] Furthermore, the micro-pattern for transfer on the template M1 can be stretched obliquely as shown in Fig. 17 (a). A micro-pattern for transfer on a template M4 can be formed by multiple extremely small cylindrical (or square columns or the like) protrusions as shown in Fig. 17 (b). Alternatively, a micro-pattern for transfer on a template M5 may be formed by multiple extremely small cylindrical holes as shown in Fig. 17 (c).
[158] Furthermore, as shown in Fig. 18, continuous micro-patterns can be formed on a sheet-shaped substrate by a first group of transfers and formation of micro-patterns TR1 as well as the second group of transfers and formation of the micro-pattern TR2.
[159] Note that the micro-pattern forming method according to the first embodiment is an example of a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on the template. The micro-pattern forming method includes: a covering step for covering a surface of the substrate with a layer of a transfer material; a transfer step for transferring the micro-pattern for transfer at predetermined intervals at a plurality of points on the transfer material formed in the covering step by pressing the template more than once against a portion of the substrate having the layer of transfer material provided on its surface by the transfer step; a step of forming a micro-pattern to form the micro-pattern at predetermined intervals at a number of points on the substrate by etching, after the transfer of the micro-pattern through the transfer step, each of the micro-patterns corresponding to the micro-pattern for transfer to the template; and a removing step for removing the transfer material 534 274 42 provided in the covering step after the formation of the micro-patterns by the step of forming micro-patterns. The micro-patterns each corresponding to the micro-pattern for transfer formed on the template are continuously formed on the substrate by repeating a cycle of the coating step, the transfer step, the micro-pattern forming step and the removal step in this order several times and simultaneously changing positions to form the micro-patterns in the transfer step and the step of forming micro-patterns.
[160] According to the micro-pattern forming method according to a first embodiment, the transfer material W2 formed in the first covering step is removed after the micro-patterns (first micro-patterns) are removed by the first (first group) covering step, the first (first group) transfer step and the first ( first group) the step of forming micro-patterns formed on the substrate W1.
[161] Thus, even if the first and second micro-patterns are interconnected, precise transfer can be performed in the second transfer step. Accordingly, the coupling between the micro-patterns formed on the substrates W1 in the first step of forming micro-patterns and the micro-patterns formed on the substrate W1 in the second step of forming micro-patterns can be formed with precision. Thus, micro-patterns having a precise shape can be continuously formed on the substrate W1.
[162] Furthermore, a position of the template M1 relative to the substrate W1 is corrected by a correction step. Thus, the micro-patterns formed on the substrate W1 through the first transfer step and the like and the micro-patterns formed on the substrate W1 through the second transfer step and the like are precisely coupled to each other.
[163] Furthermore, the template M1 which changes shape is compensated by using the actuator 21 to a precise shape in the correction step. Thus, a precise transfer can be performed even if the shape of the template M1 is changed by a temperature change or the like.
[164] In addition, as shown in Figs. 14 and 15, the transfer is performed while the pressing part is moved from one end to the other end of the convex part of the stamp M3. Thus, air bubbles are less likely to be generated in the layer-to-be-formed W6 on the object-to-be-formed W5. In particular, when the overgrowth is performed by pressing the entire flat surface of the stamp M3 against the layer-to-be formed W6 on the object-to-be formed W5 in the form of a flat plate, it is unlikely that air present in the center part of the stamp The M3 extends from the periphery of the M3 to the outside (the outside of the pressing surface). Thus, air bubbles can be generated in the layer-to-be formed W6. However, by pressing the object-to-be-formed WS (layer-to-be-formed W6) while the pressing part for fl is moved from one end to the other end of the piston 55, a situation never arises where air is unlikely to escape .
[165] Furthermore, the transfer is performed while the pressing part for fl is superimposed from one end to the other end of the stamp M3, in other words, the object-to-be-formed W5 is not pressed simultaneously by the entire surface of the stamp M3. Thus, the compressive force for the transmission can be reduced compared to the conventional case. The result is that a precise transfer can be performed without increasing the stability of the device to be used before the transfer.
[166] Furthermore, when the pressing is completed, unlike the conventional case, the entire surface of the template does not adhere to the object-to-be-formed, but only the pre-surface pressed part adheres to the object-to-be-formed W5 (layer-as - shall-be formed W6). Thus, a force for separating the object-to-be-formed WS (layer-to-be-formed W6) from the stamp M3 can be reduced. The result is that the detachment of the template is simplified.
[167] [Second Embodiment] Figs. 19 and 20 are views schematically showing the steps of a micro-pattern forming method according to a second embodiment of the present invention.
[169] More specifically, in the micro-pattern forming method according to the second embodiment, a surface (for example, approximately the entire flat surface of the lower transfer material W7) first becomes the lower transfer material W7 on the substrate W1 having its surface covered with a thin film. layer of the lower transfer material W7, covered with a thin layer of the upper transfer material (for example UV curable resin before curing) W2. Through this coverage, the substrate W1, the lower transfer material W7 and the upper transfer material W2 are stacked.
[170] Thereafter, a micro-pattern for transfer to the upper transfer material W2 is transferred by pressing the template M1 against a portion of the substrate W1 (the lower transfer material W7) having the thin layer of the upper transfer material W2 provided on its surface (see Figs. 19 (al).
[172] After removal of the upper transfer material W2, surface portions of the lower transfer material W7 where the micro-patterns have been formed and other surface portions of the lower transfer material W7, where the other surface portions are connected to the above parts (for example, approximately the entire flat surface) are covered. of the lower transfer material W7), with a thin layer of the upper transfer material W2.
[174] By etching the lower transfer material W7 after the transfer of the micro-pattern to the upper transfer material W2, the micro-patterns, which correspond to the micro-pattern for transfer on the template M1 and are continuously connected to the micro-patterns shown in Fig. 19 (b), will be formed. only on the lower transfer material W7. The substrate W1 is not etched in the etching described above.
[175] By etching the substrate W1 after the removal of the upper transfer material W2, a: micro-pattern corresponding to the micro-patterns of the lower transfer material W7 (the continuous micro-pattern for transfer on the template M1) is formed on the substrate W1 (see Fig. 20 (e)) and after that, the lower transfer material W7 is removed (see Fig. 20 (1)).
[176] The micro-pattern forming method according to the second embodiment achieves the following effects in addition to the effects obtained by the micro-pattern forming method according to the first embodiment.
[178] As said substrate W1, a glass substrate can be used. As the lower transfer material, silica, a thin layer of metal such as chromium and aluminum or a resin such as an acrylic resin can be used. As the upper transfer material, a thermoplastic resin or curable resin can be used.
[179] Note that the micro-pattern forming method according to the second embodiment is an example of a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on the template. The micropattern forming method includes: a covering step for covering a surface of a lower transfer material on the substrate with a layer of an upper transfer material, the substrate having its surface covered with a thin layer of the lower transfer material; a transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the upper transfer material formed in the covering step by pressing the template more than once (for example, at intervals slightly narrower than the width of the template) against a portion of the substrate having the thin layer of the upper transfer material provided on its surface by the covering step; a step of forming a micro-pattern to form the micro-pattern at predetermined intervals at a number of points on the lower transfer material by etching after the transfer of the micro-pattern through the transfer step, the micro-patterns each corresponding to the micro-pattern for transfer to the template; and a removal step for removing the transfer material, which is provided in the covering step after the formation of the micro-patterns by the step of forming micro-patterns. The micro-patterns each corresponding to the micro-pattern for transfer formed on the template are formed continuously on the lower transfer material by repeating a cycle with the covering step, the transfer step, the step of forming the pattern and the removal step in this order several times while, accordingly others to form micro-patterns in the transfer step and the step of forming micro-patterns. Thereafter, a micro-pattern corresponding to the micro-pattern on the lower transfer material, on the substrate, is formed by etching after the formation of the micro-patterns on the lower transfer material. Thereafter, micro-patterns are continuously formed, each corresponding to the micro-pattern for transfer formed on the template, on the substrate, by removing the lower transfer material after the formation of micro-patterns on the substrate.
[180] (Third Embodiment) Fig. 21 is a view schematically showing the steps of a micro-pattern forming method according to a third embodiment of the present invention.
[181] The micro-pattern forming method according to the third embodiment differs from the micro-pattern forming method according to the first embodiment in that a substrate W1 is formed by stacking a first material W1 1 made of, for example, silicon, a second material W8 made of, for example, silica, and a third material W9 made of, for example, silicon. The other points are approximately the same as the micro-pattern forming method according to the first embodiment.
[182] More specifically, in the micro-pattern forming method according to the third embodiment, a surface of a third material W9 on the substrate (SOI; silicon on insulator) W1 is first covered with a layer of a transfer material (for example, an ultraviolet light curable resin W10, where the substrate W1 is formed by stacking the first plate-like first material (for example, Si; silicon) W11, the thin-layer-like second material (for example, silica] W8, and the thin-layer-like third material (for example, Si; the third the material may be the same as or different from the first material W1 1).
[183] Thereafter, a micropattern is transferred for transfer to the transfer material W10 by pressing a template M1 against a portion of the substrate W1 having a thin layer of the transfer material W10 provided on its surface (see Fig. 21 (a)).
[184] By etching, after the transfer of micro-patterns to the transfer material W10, only on the third material W9 a micro-pattern corresponding to the micro-pattern for transfer on the template M 1 is formed. Then, the transfer material W10 is removed (see Fig. 21 (b)).
[185] After the removal of the transfer material W10, surface parts of the third material W9 where the micro-patterns are formed and other parts of the third material 534 274 48 W9 are covered, where the other parts are connected to the parts above, (for example, approximately the entire surface of the third material W9) with a thin layer of transfer material W10.
[187] By etching, after the transfer of the micro-pattern to the transfer material W10, only micro-patterns are formed on the third material W9 which correspond to the micro-pattern for transfer on the template M1 and which are continuously connected to the micro-patterns shown in Fig. 21 (b). Then the transfer material W10 is removed (see Fig. 21 (dl)).
[188] According to the micro-pattern forming method according to the third embodiment, in each of the micro-pattern forming steps, the second material W8 on the substrate W1 is not etched in the formation of the micro-patterns on the third material W9 by etching. Thus, concave portions of the micro-patterns formed on the substrate W1 (the third material W9) have a uniform depth. Thus, the micro-pattern having a more precise shape can be formed on the substrate W1.
[189] Note that the micro-pattern forming method according to the third embodiment is an example of a micro-pattern forming method for continuously forming micro-patterns on. a substrate, where the micro-patterns each correspond to a micro-pattern for transfer formed on a template. The forming chromium pattern forming method includes: a covering step of covering a surface of a third material on the substrate with a thin layer of a transfer material, the substrate being formed by stacking a first material, a thin layer-like second material and a thin layer-like third material; a transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the transfer material formed in the coating step by pressing the template more than once against a portion of the substrate having the thin layer of transfer material provided on its surface by the covering step; a step of forming 534 274 49 micropatterns to form the micro-patterns at predetermined intervals at a number of points only on the third material by etching after the transfer of the micro-patterns through the transfer step, the micro-patterns each corresponding to the micro-patterns for transfer on the template; and a removal step for removing the transfer material, which is provided in the covering step after the formation of the micro-pattern through the step of forming the micro-pattern. The micro-patterns each corresponding to the micro-pattern for transfer formed on the template are continuously formed on the substrate by repeating a cycle of the coating step, the transfer step, the micro-pattern forming step and the removal step in this order several times and simultaneously in accordance with this change position to form the micro-patterns in the transfer step and the step of forming micro-patterns.
[190] [Fourth Embodiment] Figs. 22 and 23 are views schematically showing the steps of a micropattern forming method according to a fourth embodiment of the present invention.
[192] More specifically, in the molding method of rnikzo patterns according to the fourth embodiment, first a surface of the substrate W1 is covered with a layer of the transfer material W2. Thereafter, a micro-pattern for transfer to the transfer material W2 is transferred by pressing the template M1 against the transfer material W2 (see Fig. 22 (a)]. In that case, the remaining layers are removed, for example, by using Oq plasma to expose the surface of the substrate W1 at the lower part of the concave portions.
[193] Thereafter, the cover elements W21 are provided in parts (the lower parts of the concave parts of the micro-pattern for transfer) where the substrate W1 is exposed, by the transfer of the micro-pattern for transfer. The toe elements W2 1 are formed by elements (for example, metal elements) of a different type from the transfer material W2. Furthermore, the transfer material W21 is provided by plating or deposition (physical deposition such as vacuum deposition or chemical deposition can be used).
[195] After the parts where the substrate W1 is exposed are covered with the cover elements W21 shown in Fig. 22 (b), the transfer material W2 is removed. This removal is performed by using, for example, a solvent which dissolves the transfer material W2 without dissolving the substrate W1 and the cover elements W2 1.
[196] Thereafter, surface portions of the substrate W1 are covered (surface portions of the substrate W1 where the cover elements W21 do not exist and the substrate W1 is exposed as the cover elements W21 remain only on a flat surface of the substrate W1 by removing the transfer material W2 and the cover elements W21 form a micro pattern). a 534 274 51 layer of the Transfer Material W2. A thickness of the transfer material W2 in this position is approximately equal to a thickness of the transfer material W2 provided in the first position (see Fig. 22 (a)) and a thickness of the cover elements W21 in Fig. 22 (b).
[197] Next, a micro-pattern for transfer to the transfer material W2 is transferred by pressing the template M1 against the substrate W1 having the layer of the transfer material W2 provided on its surface (see Fig. 22 (c)). As described above, there is also a case in this situation, when thin layers of the transfer material W2 are left at the lower parts of the concave parts of the transfer material W2. In that case, the remaining layers are removed, for example, by using an O 2 plasma to expose the surface of the substrate W1 at the lower part of the concave portions.
[198] Then, as in the case above, parts where the substrate W1 is exposed are covered by the transfer of the micro-pattern for transfer with the cover elements W21 (see Fig. 23 (d)), and then the transfer material W2 is removed. Note that, in the case where the transfer material W2 is removed, a micro-pattern is formed for transferring the cover elements (provided by each of the cover steps) W21 corresponding to the micro-pattern for transfer to the template M1 on the flat surface of the substrate W1.
[199] After removal of the transfer material W2, a micro-pattern corresponding to the micro-pattern for transfer on the template M1 is formed on the surface of the substrate W1 by etching using the cover elements W21 as a resist layer (protective layer) (see Fig. 23 (c)). After the formation of the micro-pattern, the cover elements W21 are removed (see Fig. 23 (1)).
[200] Thus, the micro-patterns each corresponding to the micro-pattern formed on the template M1 on the substrate W1 are continuously formed.
[201] Note that the micro-pattern forming method according to the fourth embodiment is an example of a micro-pattern forming method for continuously forming micro-patterns on a substrate, the micro-patterns each corresponding to a micro-pattern for transfer formed on a template. The micropattern forming method includes: a covering step for covering a surface with a layer of a transfer material; a transfer step for transmitting the micro-pattern for transfer at predetermined intervals at a plurality of points on. the transfer material formed in the covering step by pressing the template more than once against a part of the substrate having the thin layer of transfer material provided on its surface through the covering step; a providing step for providing a cover member on a portion where the substrate is exposed by the transmission of the micro-pattern for transfer in the transfer step; and a removing step for removing the transfer material, which is provided in the covering step after covering the part of the part where the substrate is exposed with the covering elements in the providing step. The micro-pattern corresponding to the micro-pattern for transfer on the template is formed on the substrate by etching using the cover elements W as resist layers after repeating the respective steps for multiple cycles in the order of covering steps, transfer steps, supply steps and removal steps. The micro-patterns each corresponding to the micro-pattern for transfer formed on the template are formed continuously on the substrate by removing the cover elements provided in the supply step after the formation of the micro-pattern.
[202] The present invention is not limited to the description of the embodiments of the invention above but can be implemented in other variants by making appropriate changes thereto.
[203] Please note that the entire contents of Japanese Patent Application No. 2007-59016 (submitted: March 8, 2007) and 2008-8011 (submitted: January 17, 2008) are incorporated into this text by reference.

权利要求:
Claims (44)
[1]
Micro-pattern forming method for continuously forming micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer formed on a template (M1), characterized in that the micro-pattern forming method comprises: a first coating step for covering a surface of the substrate (W1) with a layer of transfer material (W2); a first transfer step for transferring the nickel pattern for transfer at predetermined intervals at a number of points to the transfer material (W2) formed in the first covering step by pressing the template (M1) against the substrate (W1) having the layer of transfer material (W2) provided on its surface through the first covering step; a first step of forming a micro-pattern for forming a micro-pattern on the substrate (W1) by etching after the transfer of the xrxiliro-pattern through the first transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template (M 1); a first removal step for removing the transfer material (W2), which is provided in the first filling step, after formation of the micro-pattern by the first step of forming a micro-pattern; a second covering step for covering surface portions of the substrate (W 1) with a layer of the transfer material (W2) after removal of the transfer material (W2) in the first removal step; a second transfer step for transferring the micro-pattern for transfer at points other than the points which received transfer in the first transfer step to the transfer material (W2) formed in the second covering step by pressing a template (M1) against the substrate (W1) with the layer of transfer material (W2) provided on its surface in the second covering step; a second step of forming a micro-pattern to form a micro-pattern on. a substrate (W1) by etching after the transfer of the 534 274 micro-pattern in the second transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template (M1); and a second removal step for removing the transfer material (W2), which is provided in the second coverage step, after the formation of the micro-pattern in the second step for forming micro-patterns.
[2]
The micro-pattern forming method according to claim 1, characterized in that the forming method further comprises: a position relation detecting step for detecting a positional relationship between the micro-pattern formed in the first step of forming the micro-pattern and the micro-pattern for transfer formed on the template (M 1) after forming the micro-pattern the first step of forming micro-patterns and before the transfer is performed in the second transfer step; and a correction step for correcting a position of the template (M 1) relative to the substrate (W 1) based on a result of the detection in the position relation detecting step, so that the micro-pattern for transmission to be formed in the second step for forming micro-patterns is precisely coupled to the micro-pattern formed in the first step of forming micro-patterns.
[3]
Micro-pattern forming method according to claim 2, characterized in that the correction step is a step which performs the correction by compensating for a change in shape of the template (M1) to a precise shape by using an actuator (21).
[4]
Micro-pattern forming method according to claim 2, characterized in that micro-patterns, through the first transfer step and the first step for forming micro-patterns, are formed in a first part (TR1a) of the transfer material (WZ) and in a second part (TR1b) separated from the first part (TR1a) with a predetermined distance; a micro-pattern, through the second transfer step and the second micro-pattern forming step, is formed in a third part (TR2) connecting the first part (TR1a) and the second part (TR1b); and the position relationship detecting step is a step of detecting a position relationship between the micro pattern formed in the first step of forming the micro pattern and the transfer transfer micro pattern formed on the template (M1) by detecting a position deviation of the transfer transfer micro pattern (M1). ) at a boundary line between the first part (TR1a) and the micro-pattern for transmission formed on the template (M1) and by * detecting a positional deviation of the micro-pattern for transmission on the template (M1) at a boundary line between the second part (TR1b) and the micro-pattern for transfer formed on the template (M 1).
[5]
Micro-pattern forming method according to claim 4, characterized in that a part of the template (M1) with the micro-pattern for transfer formed thereon is arranged to have a rectangular planar shape; by arranging the first part (TR1a), the third part (TR2) and the second part (TR1b) in a straight line, a micro-pattern is formed within a rectangular afea; the position relation detecting step is a step for detecting, on one side in a width direction of the rectangular micro-pattern, a positional deviation of the micro-pattern on the template (M1) relative to the first part (TR1a) at the boundary line between the first part (TR1a) and the micro-pattern for transmission formed on the template (M 1) and a positional deviation of the micro-pattern for transmission on the template (M 1) relative to the second part (TR1b) at the boundary line between the second part (TR1b) and the micro-pattern for transmission formed on the template (M1), and for detecting, on the other side of the width direction of the rectangular micro-pattern, a positional deviation of the micro-pattern for transfer on the template (M 1) relative to the first part (TR 1a) at the boundary line between the first part (TR 1a) and the micro-pattern for transfer formed on the template (M 1); and the correction step is a step of performing the correction by compensating the dimension of the template (M1) in the width direction by changing an elastic deformation portion of the template (M1) in the width direction of the rectangular microsattern using actuator (21) based on the position deviation of the other side in the width direction. 534 274 Sb
[6]
The micro-pattern forming method according to claim 1, characterized in that the forming method further comprises: a step of forming a stamp (M3, 55) using a substrate (W1) including a micro-pattern formed using the micro-pattern forming method, in which a part of the star shell (M3, 55) with the micro-pattern formed thereon is shaped to be elongate by performing the transfer steps and the micro-pattern forming steps aligned with each other; and a third transfer step for transferring the micro-pattern on the stamp (M3, 55) to an object-to-be-formed (W5), the part of the stamp (M3, 55) having the micro-pattern formed thereon being formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder; or the part of the piston (M3, 55) with the micro-pattern formed thereon is formed into a convex surface shape by using a portion a lateral surface of an elliptical cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder; the transfer is performed during the displacement of a linear pressing part of the convex surface against the object-to-be formed (W5) from one end to the other end of the convex surface.
[7]
Micro-pattern forming method according to claim 6, characterized in that the stamp (M3, 55), after performing the third transfer, is moved in a width direction of the micro-pattern on the stamp (M3, 55) relative to the object-to-be-formed (W5) ; a stamp (M3, 55) is manufactured by electroforming using a substrate (W1) including a micro-pattern formed by using the micro-pattern forming method; and 534 274 S by a fourth transfer step for transferring the micro-pattern on the stamp (M3, 55) made by electroforming on the object-to-be formed (WS), where the micro-pattern on the stamp (M3, SS) is transferred to the object-to-be-formed ( WS) in a way connected in the width direction.
[8]
The micro-pattern forming method according to claim 6 for continuously forming a micro-pattern on the object-to-be-formed (WS), wherein the micro-pattern corresponds to the micro-pattern formed on the stamp (M3, SS), characterized in that the forming method further comprises: a third covering step for covering a surface of the object-to-be-formed (WS) with a layer of a transfer material; a fourth transfer step for transferring the micro-pattern for transfer to the transfer material formed in the third covering step by pressing the stamp (M3, SS) against the object-to-be formed (WS) with the layer of the transfer material provided on its surface through the third covering step; a third step of forming a micro-pattern to form a micro-pattern on the object-to-be formed (WS) by etching after the transfer of the micro-pattern through the fourth step, the micro-pattern corresponding to the micro-pattern for transfer to the stamp (M3, 55); a third removal step for removing the transfer material, which is provided in the third covering step, after the formation of the micro-pattern by the third step for forming a micro-pattern; a fourth covering step for covering the surface of the object-to-be-formed (W5) with a layer of transfer material after the removal of the transfer material in the third removal step; a fifth transfer step for transferring the micro-pattern for transfer to the transfer material formed in the fourth covering step by pressing the stamp (M3, SS) against the object-to-be formed (WS) having the layer of the transfer material provided on its surface through the fourth covering step; a fourth micro-pattern for forming a micro-pattern on the object-to-be-formed (WS) by etching after the transfer 534 274 S8 of the micro-pattern through the fifth transfer step, the micro-pattern corresponding to the micro-pattern for transfer on the template (M1); and a fourth removal step for removing the transfer material provided in the fourth covering step after the formation of the micro-pattern through the fourth micro-pattern forming step.
[9]
Micro-pattern forming method according to claim 8, characterized in that in each transfer step, the part of the stamp (M3, 55) with the micro-pattern formed thereon is formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder, or the part of the piston (M3, 55) with the micro-pattern formed thereon is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder in such a way that it the longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder; and the transfer is performed while moving a linear pressing part of the convex surface against the object-to-be formed (W5) from one end to the other end of the convex cylinder.
[10]
Micro-pattern forming method according to claim 1, characterized in that the micro-patterns are formed in parts of the substrate (W1) corresponding to the parts of a color of a grid pattern in the first transfer step and the first step of forming micro-patterns, and the micro-patterns are formed on parts of the substrate ( W1) corresponding to the parts of the second color of the grid pattern in the second transfer step and the second step of forming micro-patterns.
[11]
Micro-pattern forming method for continuously forming micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer on a template (M1), characterized in that the micro-pattern forming method comprises: 534 274 S9 a first blanking step for coverage of a surface of a lower transfer material (W7) on a substrate (W1) with a layer of an upper transfer material (W2), the surface of the substrate being covered with a layer of the lower transfer material (W7); a first transfer step for transferring the micro-pattern before transferring at predetermined intervals at a number of points to the upper transfer material (W2) formed in the first covering step by pressing the template (M1) against the substrate (W1) having the layer of the upper transfer material (W2). ) provided on its surface by the first covering step; a first step of forming a micro-pattern to form a micro-pattern on the lower transfer material (W7) by etching after the transfer of the micro-pattern through the first transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template (M 1); a first removal step for removing the upper transfer material (W2) provided in the first covering step after the formation of the micro-pattern by the first step for forming a micro-pattern; a second covering step for covering the surface of the lower transfer material (W7) with a layer of the upper transfer material (W2) after removing the upper transfer material (W2) in the first removal step; a second transfer step for transferring the micro-pattern for transfer at points other than the points which received transfer in the first transfer step to the upper transfer material (W2) formed in the second covering step by pressing a template (M1) against the substrate (W1) having the layer of the upper transfer material (W2) provided on its surface by the second covering step; a second micro-pattern forming step for forming a micro-pattern on the lower transfer material (W7) by etching after transferring the micro-pattern through the second transfer step, the micro-pattern corresponding to the micro-pattern for transfer on the template (M1); a second removal step for removing the upper transfer material (W2) provided in the second covering step after the formation of the micro-pattern by the second step for forming the micro-pattern; a third micro-pattern forming step for forming the micro-pattern on the substrate (W1) by etching after the removal of the upper transfer material (W2) in the second removal step, the micro-pattern corresponding to the micro-pattern on the lower transfer material (W7); and a third removal step for removing the lower transfer material (W7) after the formation of the micro-pattern by the third micro-pattern forming method.
[12]
The micro-pattern forming method according to claim 11, characterized in that the forming method further comprises: a position relation detecting step for detecting a positional relationship between the micro-pattern formed in the first step for forming the micro-pattern and the micro-pattern for transfer formed on the template (M 1) after forming the micro-pattern in the first step of forming micro-patterns and before the transfer is performed in the second transfer step; and a correction step for correcting a position of the template (M1) relative to the substrate (W1) based on a result of the detection in the position relation detecting step, so that the micro-pattern for transmission to be formed in the second step for forming micro-patterns is precisely coupled to the micro-pattern formed. in the first step of forming micro-patterns.
[13]
Micro-pattern forming method according to claim 12, characterized in that the correction step is a step for performing the correction by compensating for a deformation of the template (M 1) to a precise shape by using an actuator (2 1).
[14]
A micro-pattern forming method according to claim 12, characterized in that micro-patterns, through the first transfer step and the first step for forming a micro-pattern, are formed in a first part (TR1a) of the transfer material 534 274 61 (W2) and in a second part ( TR1b) separated from the first part (TR1a) by a predetermined distance; through the second transfer step and the second step for forming micro-patterns, micro-patterns are formed in a third part (TR2) which connects the first part (TR1a) and the second part (TR1b); and the position relation detecting step is a step of detecting a position relation between the micro pattern formed in the first step of forming the micro pattern and the inikro pattern for transfer formed on the template (M1) by detecting a position deviation of the micro pattern for transfer on the template (M 1) at a boundary line between the first part (TR1a) and the micro-pattern for transmission formed on the template (M1) and by detecting a position deviation of the micro-pattern for transmission on the template (M1) at a boundary line between the second part (TR1b) and the micro-pattern for transmission formed on molds (M 1).
[15]
Micro-pattern forming method according to claim 14, characterized in that a part of the template (M 1) with the micro-pattern for transfer formed thereon is arranged to have a rectangular planar shape; by arranging the first part (TR1a), the third part (TR2) and the second part (TR1b) in a straight line, a micro-pattern is formed within a rectangular area; the position relation detecting step is a step for detecting, on the one hand in a width direction of the rectangular micro-pattern, a positional deviation of the micro-pattern for transmission on the template (M 1) relative to the first part (TR1a) at the boundary line between the first part (TR1a) and the micro-pattern formed on the template (M1) and a positional deviation for: the micro-pattern for transfer on the template (M1) relative to the second part (TR1b) at a boundary line between the second part (TR1b) and the micro-pattern for transfer formed on the template (M1), and detecting, on the other hand, in a width direction of the rectangular micro-pattern, a positional deviation of the micro-pattern for transfer on the template (M1) relative to the first part (TRla) at the boundary line between the first part (TRla) and the micro-pattern for transfer formed on the template ( M 1); and the correction step is a step of performing the correction by compensating the dimension of the template (M1) in the width direction by changing an elastic deformation portion of the template (M1) in the width direction of the rectangular microsattern by using an actuator (21) based on the deviating proportion in position on the other side in the width direction.
[16]
The micro-pattern forming method according to claim 11, characterized in that the forming method further comprises: a step of forming a stamp (M3, 55) by using a substrate (W1) including a micro-pattern formed by using the micro-pattern forming method, in which a part of the stamp (M3, 55) with the micro-pattern formed thereon is shaped to be elongate by performing the transfer steps and the micro-pattern forming steps aligned with each other; and a third transfer step for transferring the micro-pattern on the stamp (M3, 55) to an object-to-be-formed (W5), the part of the stamp (M3, 55) having the micro-pattern formed thereon being formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder; or the part of the piston (M3, 55) with the micro-pattern formed thereon is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder. ; and the transfer is performed below for exposing a linear pressing part of the convex surface against the object-to-be formed (W5) from one end to the other end of the convex surface.
[17]
Micro-pattern forming method according to claim 16, characterized in that 534 274 (95 stamp (M3, 55), after performing the third transfer, is displaced in a width direction of the micro-pattern on the stamp (M3, 55) relative to the object-to-be a stamp (M3, 55) is produced by electroforming using a substrate (W1) including a micro-pattern formed by using the micro-pattern forming method, and by a fourth step of transferring the micro-pattern to the stamp (M3, 55). ) produced by electroforming to the object-to-be-formed (W5), where the micro-pattern on the stamp (M3, 55) is transferred to the object-to-be-formed (WS) in a manner coupled in the width direction.
[18]
The micro-pattern forming method according to claim 16 for continuously forming a micro-pattern on the object-to-be-formed (WS), the micro-pattern corresponding to the micro-pattern formed on the stamp (M3, SS), characterized in that the forming method further comprises: a third covering step of covering a surface of the object-to-be-formed (WS) with a layer of a transfer material; a fourth transfer step for transferring the nickel pattern for transfer to the transfer material formed in the third coverage step by pressing the stamp (M3, 55) against the object-to-be formed (WS) with the layer of transfer material provided on its surface through the third coverage step; a fourth micro-pattern forming step for forming a micro-pattern on the object-to-be formed (WS) by etching after the transfer of the micro-pattern through the fourth step, the micro-pattern corresponding to the micro-pattern for transfer to the stamp (M3, 55); a fourth removal step for removing the transfer material provided in the third covering step after the formation of the micro-pattern by the fourth step for forming a micro-pattern. a fourth covering step for covering the surface of the object-to-be formed (WS) with a layer of the transfer material after the removal of the transfer material in the fourth removal step; 534 274 614 a fifth transfer step for transferring the micro-pattern for transfer to the transfer material formed in the fourth coverage step by pressing the stamp (M3, 55) against the object-to-be-formed (W5) having the layer of the transfer material provided on its surface through the fourth covering step; a fifth micro-pattern forming step for forming a micro-pattern on the object-to-be-formed (W5) by etching after the transfer of the micro-pattern through the fifth transfer step, the micro-pattern corresponding to the micro-pattern for transfer to the template (M 1); and a fifth removal step for removing the transfer material provided in the fourth covering step after the formation of the micro-pattern by the fifth step for forming the micro-pattern.
[19]
The micro-pattern forming method according to claim 18, characterized in that in each transfer step, the part of the stamp (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape formed by using a portion of a lateral surface of a cylinder on such a means that a longitudinal direction of the portion is set as a peripheral direction of the cylinder; or the part of the piston (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape formed by using a portion of a lateral surface of an elliptical cylinder on such that the longitudinal direction of the portion is set as a peripheral direction of the the elliptical cylinder; and the transfer is performed while a linear pressing part of the convex surface is moved against the object-to-be formed (WS) from one end to the other end of the convex surface.
[20]
Micro-pattern forming method according to claim 1, characterized in that the micro-patterns are formed in parts of the substrate (W1) corresponding to the parts of a color of a grid pattern in the first transfer step and the first step for forming micro-patterns, and the micro-patterns are formed on parts of the substrate (W1) 534 274 55 corresponding to the parts of the second color of the grid pattern in the second transfer step and the second step for forming micro-patterns.
[21]
Micro-pattern forming method for continuously forming micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer formed on a template (M1), characterized in that the micro-pattern forming method comprises: a first coating step for covering a surface of a third material (W9) in the substrate (W1) with a layer of a transfer material (W10), which substrate (W1) is formed by stacking a first material (W1 1), a layer-like second material (W8) and a layer-like third material (W9); a first transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the transfer material (W 10) formed in the first covering step by pressing the template (M1) against the substrate (W1) having the layer with the transfer material (W10) provided on its surface through the first covering step; a first step of forming a micro-pattern to form a micro-pattern on the third material (W9) by etching after the transfer of the micro-pattern through the first transfer step, which micro-pattern corresponds to the micro-pattern for transfer to the template (M 1); a first removal step for removing the transfer material (W10) provided in the first coverage step after the formation of the micron pattern in the first micro-pattern forming step; a second covering step for covering the surface of the third material (W9) with a layer of the transfer material (W10) after the removal of the transfer material (W10) in the first removal step; a second transfer step for transferring the micro-pattern for transfer at points other than the points which received transfer in the first transfer step on the transfer material (W10) formed in the second covering step by pressing a template (M 1) against the substrate (W 1) having the layer with the transfer material (W10) provided on its surface through the second covering step; 534 274 bl »a second step of forming a micro-pattern to form a micro-pattern on the third material (W9) by etching after the transfer of the micro-pattern in the second transfer step, which micro-pattern corresponds to the micro-pattern for transfer to the template (M 1); and a second removal step for removing the transfer material (W10) provided in the second covering step after the formation of the micro-pattern by the second micro-pattern forming step.
[22]
The micropattern forming method according to claim 21, characterized in that the forming method further comprises: a position relation detecting step for detecting a positional relationship between the micropattern formed in the first step of forming the micropattern and the transfer transfer micromattern formed on the template (M1) after the first step of forming micro-patterns and before the transfer is performed in the second transfer step; and a correction step for correcting a position of the template (M1) relative to the substrate (W1) based on a result of the detection in the position relation detecting step, so that the micro-pattern for transmission to be formed in the second step of forming micro-patterns is precisely coupled to the micro-pattern formed in the first step of forming micro-patterns.
[23]
Micro-pattern forming method according to claim 22, characterized in that the correction step is a step which performs the correction by compensating for a change in shape of the template (M1) to a precise shape by using an actuator (21).
[24]
Micro-pattern forming method according to claim 22, characterized in that micro-patterns, through the first transfer step and the first step for forming micro-patterns, are formed in a first part (TR 1a) of the transfer material (W10) and in a second part (TR1b) separated from the first part (TRla) with a predetermined distance; 534 274 lo a micro-pattern, through the second transfer step and the second step for forming the micro-pattern, is formed in a third part (TR2) connecting the first part (TR1a) and the second part (TR 1b); and the position relation detecting step is a step for detecting a position relation between the micro pattern formed in the first step of forming the micro pattern and the micro pattern for transfer formed on the template (M1) by detecting a position deviation of the micro pattern for transfer on the template (M 1) at a boundary line between the first part (TR1a) and the micro-pattern for transfer formed on the template (M1) and by detecting a positional deviation of the micro-pattern for transfer on the template (M1) at a boundary line between the second part (TR1b) and the micro-pattern for transfer formed on molds (M 1).
[25]
The micro-pattern forming method according to claim 24, characterized in that a part of the template (M 1) having the micro-pattern for transfer formed thereon is formed with a flat, rectangular shape; by arranging the first part (TR1a), the third part (TR2) and the second part (TR1b) in a straight line, a micro-pattern is formed within a rectangular area; the position relation detecting step is a step for detecting, on one side in the width direction of the rectangular micro-pattern, a position deviation of the micro-pattern for transfer on the template (M1) relative to the first part (TR1a), at the boundary line between the first part (TR1a) and the micro-pattern for transfer formed on the template (M1), and a position deviation of the micro-pattern for transfer on the template (M1) relative to the second part (TR1b), at the boundary line between the second part (TR1b) and the micro-pattern for transfer formed on the template (M1), and for detection, on the other hand in the width direction of the rectangular micro-pattern, of a positional deviation of the micro-pattern for transfer on the template (M1) relative to the first part (TR1a), at the boundary line between the first part (TR1a) and the micro-pattern for transfer formed on the template (M 1); and the correction step is a step of performing correction by compensating the dimension of the template (M1) in the width direction by changing an elastic deformation proportion of the template (M1) in the width direction of the rectangular micro-pattern 534 274 68, by using an actuator (21) based on the position deviation on the other side in the width direction.
[26]
Micro-pattern forming method according to claim 21, characterized in! in that the forming method further comprises: a step of forming a stamp (M3, 55) by using a substrate (W1) comprising a micro-pattern formed by using the micro-pattern forming method, in which a part of the template (M1) having the micro-pattern formed therein is shaped to be elongate by performing the transfer steps and the micro-pattern forming steps in line with each other; and a third transfer step for transferring the micro-pattern on the stamp (M3, 55) to an object-to-be-formed (W5), wherein the part of the stamp (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder; or the part of the piston (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder in such a manner that the longitudinal direction of the portion is set as a peripheral direction of the elliptical cylinder. ; and the transfer is performed while a linear pressing member of the convex surface is moved against the object-to-be formed (WS) from one end to the other end of the convex surface.
[27]
Minkro pattern forming method according to claim 26, characterized in that the stamp (M3, 55), after the third transfer is performed, is moved in the width direction of the micro pattern on the stamp (M3, 55) relative to the object-to-be formed (W5). ; 534 274 (fl a stamp (M3, 55) is manufactured by electroforming using a substrate (W1) comprising a micro-pattern formed by the method of forming a micro-pattern, and by a fourth transfer step for transferring the micro-pattern to the star pile (M3, 55). 55) made by electroforming on the object-to-be-formed (WS), so that the micro-pattern on the stamp (M3, 55) is transferred to the object-to-be-formed (W5) in a width-connected manner.
[28]
The micro-pattern forming method according to claim 26, for continuously forming the micro-pattern on the object-to-be-formed (W5), which micro-pattern corresponds to the micro-pattern formed on the stamp (M3, 55), characterized in that the forming method further comprises: a third covering step for covering a surface of the object-to-be-formed (W5) with a layer of a transfer material; a fourth transfer step for transferring the micro-pattern to be transferred to the transfer material formed in the third cover step by pressing the star pellet (M3, 55) against the object-to-be formed (W5) and having the layer with the transfer material on its surface through the third cover step ; a third micro-pattern forming step for forming a micro-pattern on the object-to-be-formed (W5) by etching after the transfer of the micro-pattern through the fourth transfer step, which micro-pattern corresponds to the micro-pattern for transfer to the stamp (M3, 55); a third removal step for removing the transfer material provided in the third coverage step after the formation of the micro-pattern by the third micro-pattern forming step; a fourth covering step for covering a surface of the object-to-be formed (WS) with a layer of the transfer material after removal of the transfer material by the third removal step; a fifth transfer step for transferring the micro-pattern for transfer to the transfer material formed in the fourth covering step by pressing the stamp (M3, 55) against the object-to-be-imaged (W5) and having the layer of transfer material provided on its surface by the fourth coverage step; a fourth micro-pattern forming step with forming a micro-pattern on the object-to-be-formed (W5) by etching after the transfer of the micro-pattern through the fifth transfer step, which micro-pattern corresponds to the transfer pattern on the template (M 1); and a fourth drilling step of removing the transfer material provided in the fourth covering step after the formation of the micron pattern in the fourth micro-pattern forming step.
[29]
The micro-pattern forming method according to claim 28, characterized in that in each transfer step, the part of the stamp (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder; or the portion of the piston (M3, 55) having the nickel pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder on such a transmitter that the longitudinal direction of the portion is set as a peripheral direction of the elliptical cylinder. ; and the transfer is performed while a linear pressing part of the convex surface is moved against the object-to-be formed (W5) from one end to the other end of the convex surface.
[30]
The micro-pattern forming method according to claim 21, characterized in that micro-patterns are formed in portions of the substrate (W1) corresponding to portions having a color of a grid pattern in the first transfer step and the first step for forming micro-patterns, and micro-patterns are formed in parts of the substrate ( Wl) 534 274 71 corresponding portions with the second color of the grid pattern in the second transfer step and the second step of forming micro-patterns.
[31]
Micro-pattern forming method for the continuous formation of micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer formed on a template (M1), characterized in that the micro-pattern forming method comprises: a first covering step for covering a surface of the substrate (W1) with a layer of an overlying material (W2); a first transfer step for transferring the micro-pattern for transfer at predetermined intervals at a number of points on the transfer material (W2) formed in the first covering step by pressing the template (M 1) against the substrate (W 1) having the layer of transfer material (W2) provided on its surface through the first covering step; a first providing step for providing a cover member (W21) in a portion where the substrate (W1) is exposed by the transmission of the micro-pattern for transmission in the first transfer stage; a first removal step for removing the transfer material (W2) provided in the first covering step after covering the part where the substrate (W 1) is exposed with the covering element (W21) in the first providing step; a second covering step for covering surface portions of the substrate (W1) with a layer of the transfer material (W2) after the removal of the transfer material (W2) in the first removal step; a second transfer step for transferring the micro-pattern for transfer at points other than the points which received transfer in the first transfer step on the transfer material (W2) formed in the second covering step by pressing the template (M 1) against the substrate (W 1) having the layer with transfer material (W2) provided on its surface by the second covering step; 534 274 2 a second supply step for covering a part where the substrate (W1) is exposed by transferring the micro-pattern for transfer in the second transfer step with a cover element (W2 1); a second removing step for removing the transfer material (W2) provided in the second covering step after covering the part where the substrate (W1) is exposed with the covering element (W2) in the second providing step; a micro-pattern forming step for forming a micro-pattern on the substrate (W1) by etching after the removal of the transfer material (W2) by the second removal step, which micro-pattern corresponds to the micro-pattern for transfer to the template (M1); and a third removal step with removal of the cover elements (W2 1) provided in the first and second supply steps after the formation of the micro-pattern in the micro-pattern formation step.
[32]
The micro-pattern forming method according to claim 31, characterized in that the forming method further comprises: a position ratio detecting step for detecting a positional relationship between the micro-pattern formed in the first step of forming the micro-pattern and the micro-pattern for transfer formed on the template (M 1) after in the first step for forming micro-patterns and before the transfer is performed in the second transfer step; and a correction step of correcting a position of the template (M1) relative to the substrate (W1) based on the result of the detection in the position relation detecting step, so that the micro-pattern for transmission to be formed in the second step of forming micro-patterns is precisely coupled to the micro-pattern formed in the first step of forming micro-patterns.
[33]
Micro-shaping method according to claim 32, characterized in that the correction step is a step of performing the correction by compensating for a change in shape of the template (M 1) to an accurate shape by using an actuator (21).
[34]
Micro-pattern forming method according to claim 32, characterized in that micro-patterns, through the first transfer step and the first micro-pattern forming step, are formed in a first part (TR1a) of the transfer material (W2) and in a second part (TR1b) separated from the first part ( TRla) with a predetermined distance; a micro-pattern, through the second transfer step and the second micro-pattern forming step, is formed in a third part (TR2) connecting the first part (TR 1a) and the second part (TR1b); and the position relation detecting step is a step of detecting a position relation between the micro pattern formed in the first step of forming the micro pattern and the transfer transfer micro pattern formed on the template (M1) by detecting a position deviation of the transfer transfer micro pattern (M1), at the boundary line between the first part (TR1a) and the micro-pattern for transfer formed on the template (M1) and by detecting a position deviation of the micro-pattern for transfer on the template (M1) at a boundary line between the second part (TR1b) and the micro-pattern for transfer formed on the template (M1).
[35]
A micro-pattern forming method according to claim 34, characterized in that a portion of the template (M1) having the micro-pattern for transfer formed therein is formed with a rectangular planar shape; by arranging the first part (TR1a), the third part (TR2) and the second part (TR1b) in a straight line, a micro-pattern is formed within a rectangular area; 534 274 '# 1 position relation detecting step is a step for detecting, on one side in the width direction of the rectangular micro-pattern, a position deviation of the micro-pattern for transmission on the template (M1) relative to the first part (TR1a) at a boundary between the first part (TR1a ) and the micro-pattern for transfer formed on the template (M1), and a positional deviation of the micro-pattern for transfer on the template (M1) relative to the second part (TR1b) at the boundary line between the second part (TR1b) and the micro-pattern for transfer formed on the template (M1). ), and by detecting, on the other hand in the width direction of the rectangular micro-pattern, a positional deviation of the micro-pattern for transfer on the template (M1) relative to the first part (TR1a) at the boundary line between the first part (TR1a) and the micro-pattern for transfer formed on molds (M 1); and the correction step is a step of performing the correction by compensating the dimension of the template (M1) in the width direction by changing an elastic deformation proportion of the template (M1) in the width direction of the rectangular micro-pattern by using an actuator (21) based on position deviation on the the other side in the width direction.
[36]
The micro-pattern forming method according to claim 31, characterized in that the forming method further comprises: a step of forming a stamp (M3, 55) using a substrate (W1) comprising a micro-pattern formed by using the micro-pattern forming method, in which a part of the template (M1) having a micro-pattern formed therein is formed to be elongate by performing transfer steps and micro-pattern forming steps in line with each other; and a third transfer step for transferring the micro-pattern on the stamp (M3, 55] to an object-to-be-formed (WS), the part of the stamp (M3, 55) having the micro-pattern formed therein being formed into a convex surface shape formed by use of a portion of a lateral surface of a cylinder in such a way that a longitudinal direction of the part is set as a peripheral direction of the cylinder; or 534 274 YS of the punch (M3, 55) having a micro-pattern formed therein formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder in such a way that the longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder, and the transfer is performed while a linear pressing part of the convex surface is moved towards the object. to be formed (WS) from one end to the other end of the convex surface.
[37]
Micro-pattern forming method according to claim 36, characterized in that the stamp (M3, 55), after the third transfer is performed, is moved in a width direction of the micro-pattern on the stamp (M3, 55) relative to the object-to-be-formed (W5) ; a stamp (M3, 55) is manufactured by electroforming using a substrate (W1) comprising a micro-pattern formed by using the micro-pattern forming method; and by a fourth transfer step of transferring the micro-pattern on the stamp (M3, 55) made by electroforming on an object-to-be-formed (W5), the micro-pattern on the stamp (M3, 55) being transferred to the object-to-be-formed (WS) in a coupled manner in the width direction.
[38]
The micro-pattern forming method according to claim 36 for continuously forming a micro-pattern on the object-to-be-formed (W5), the mila pattern corresponding to the micro-pattern formed on the stamp (M3, 55), characterized in that the forming method further comprises: a third covering step for covering a surface of the object-to-be-formed (WS) with a layer of a transfer material; a fourth transfer step with transfer of the micro-pattern for transfer to the transfer material formed in the third coverage step by pressing the 534 274 Yß stamp (M3, 55) against the object-to-be formed (W5) and having the layer of transfer material provided on its surface by the third covering step; a third step of forming a micro-pattern for forming a micro-pattern on the object-to-be formed (W5) by etching after the transfer of the micro-pattern through the fourth transfer step, which micro-pattern corresponds to the micro-pattern for transfer to the stamp (M3, 55); a fourth removal step for drilling the transfer material provided in the third covering step after forming the micro-pattern through the third micro-pattern forming step; a fourth covering step for covering the surface of the object-to-be-formed (W5) with a layer of transfer material after removal of the transfer material in the fourth removal step; a fifth transfer step with transfer of the micro-pattern for transfer to the transfer material (W2) formed in the fourth covering step by pressing the stamp (M3, 55) against the object-to-be-formed (W5) and having the layer of transfer material provided on its surface by the fourth covering step; a fourth micro-pattern forming step for forming a micro-pattern on the object-to-be-formed (WS) by etching after transferring the micro-pattern through the fifth transfer step, which micro-pattern corresponds to the micro-pattern for transfer to the template (M 1); and a fifth removal step of removing the transfer material provided in the fourth covering step after the formation of the micro-pattern through the fourth step of forming the micro-pattern.
[39]
Micro-forming method according to claim 38, characterized in that in each transfer step, the part of the stamp (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of a cylinder of 534 274 W such that a longitudinal direction of the part is set as a peripheral direction of the cylinder; or the part of the piston (M3, 55) having the micro-pattern formed therein is formed into a convex surface shape by using a portion of a lateral surface of an elliptical cylinder in such a manner that the longitudinal direction of the part is set as a peripheral direction of the elliptical cylinder. ; and the transfer is performed while a linear pressing part of the convex surface is moved against the object-to-be formed (W5) from one end to the other end of the convex surface.
[40]
Micro-forming method according to claim 31, characterized in that micro-patterns are formed in parts of the substrate (W1) corresponding to parts with a color of a grid pattern in the first transfer step and the first step for forming micro-patterns, and micro-patterns are formed in parts of the substrate ( W1) corresponding parts with the second color of the grid pattern in the second transfer step and the second micro-pattern formation step.
[41]
41. Micro-pattern forming method for the continuous formation of micro-patterns on a substrate (W1), where the micro-patterns each correspond to a micro-pattern for transfer formed on a template (M1), characterize! in that the forming method for microchrome patterns comprises: a covering step for covering a surface of the substrate (W1) with a layer of a transfer material (W2); an overlay step for transferring the micro-patterns for transfer at predetermined intervals at a number of points on the transfer material (W2) formed in the covering step by pressing the template (M1) more than once against the substrate (W1) having the layer of transfer material (W2) provided on its surface through the covering step; a step of forming micro-patterns for forming micro-patterns at predetermined intervals at a number of points on the substrate (W1) by etching 534 274 78 after the transfer of micro-patterns through the transfer step, which micro-patterns each correspond to the micro-pattern for transfer to the template (M 1); and a removal step for removing the transfer material (W2) provided in the covering step after the formation of the micro-patterns in the step of forming micro-patterns, the micro-patterns, each corresponding to the micro-pattern for transfer formed on the template (M1), being continuously formed on the substrate (W1). by repeating a cycle of the blurring step, the transfer step, the micro-pattern formation step and the removal step in this order several times.
[42]
A micro-pattern forming method for continuously forming micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer formed on a template (M1), characterized in that the micro-pattern forming method comprises: a covering step for covering a surface with a lower transfer material (W7) in the substrate (W1) with a layer of an upper transfer material (W2), which substrate (W1) has its surface covered with a layer of the lower transfer material (W7); a transfer pattern for transferring micro-patterns for transfer at predetermined intervals at a number of points on the upper transfer material (W2) formed in the covering step by pressing the mold more than once against the substrate (W1) having the layer with the upper transfer material (W2) provided on its surface through the covering step; a micro-pattern forming step for forming micro-patterns at predetermined intervals at a number of points on the lower transfer material (W7) by etching after the transfer of micro-patterns through the transfer step, which micro-patterns each correspond to the micro-pattern for transfer on the template (M1), and a 534 removal step with removal of the transfer material provided in the covering step after the formation of the micro-patterns by the step of forming micro-patterns, the micro-patterns, each corresponding to the micro-pattern for transfer formed on the template (M 1), being continuously formed on the lower transfer material by W7) a cycle with the covering step, the transfer step, the micro-pattern forming step and the removal step in this order several times, a micro-pattern corresponding to the micro-patterns of the lower transfer material (W7) is formed on the substrate (W1) by etching after the formation of the micro-patterns on the lower transfer. the trout material (W7), and the micro-patterns, each corresponding to the micro-pattern of transfer formed on the template (M 1), are continuously formed on the substrate (W 1) by removing the lower transfer material (W7) after the formation of the micro-pattern on the substrate.
[43]
Micro-pattern forming method for the continuous formation of micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer formed on a template (M1), characterized in that the micro-pattern forming method comprises: a covering step of covering a surface of a third material (W9) in the substrate (W1) with a layer of a transfer material [W10), which substrate (W1) is formed by stacking a first material (W11), a film-like second material (WS) and a tredje lmlike third material (W9); a transfer step of transferring the micro-patterns at predetermined intervals at a number of points on the transfer material (WIO) formed in the covering step by pressing the template (M 1) more than one thread against the substrate (W1) having the layer of transfer material (W2) provided on its surface through the coverage step; a step of forming micro-patterns to form micro-patterns at predetermined intervals at a number of points on the third material (W9) by etching after the transfer of the micro-patterns through the transfer-making step, each of which corresponds to the micro-pattern for transfer to the template (M1). ; and a removal step for removing the transfer material (WIO) provided in the blurring step after the formation of the micro-patterns by the step of forming micro-patterns, the micro-patterns, each corresponding to the micro-pattern for transfer formed on the template (M1), being continuously formed on the substrate (W1). by repeating a cycle with the blurring step, the transfer step, the micro-pattern forming step and the removal step in this order several times.
[44]
Micro-pattern forming method for the continuous formation of micro-patterns on a substrate (W1), the micro-patterns each corresponding to a micro-pattern for transfer formed on a template (M1), characterized in that the micro-pattern forming method comprises: a covering step with covering a surface of the substrate (W1) with a layer of a transfer material (W2); a transfer step with the transfer of micro-patterns for transfer at predetermined intervals at a plurality of points on the transfer material (W2) formed in the covering step by pressing the template (M1) more than once against the substrate (W1) having the layer of the transfer material (W2) provided on its surface in the covering step; a providing step for providing a fog element (W21) in a portion where the substrate (W1) is exposed during the transfer of the micro-pattern for transfer in the transfer step; and a removing step for removing the transfer material (W2) provided in the covering step after covering the part where the substrate (W1) is exposed with the covering element (W2 1) in the providing step, the micro-patterns each corresponding to the micro-pattern for transfer on the template (M 1). continuously formed on the substrate: by forming the micro-patterns, each of which corresponds to the micro-pattern for transfer on the template (M 1), on the substrate (W1) by etching after repeating a cycle with the coverage step, the transfer step, the supply step, the forming step of micro-patterns and the removal step in that order about fl several times; and by removing the cover elements (W21) provided in the supply step after the formation of the micro-patterns.

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JP4996488B2|2012-08-08|

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US20120285928A1|2012-11-15|

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DE112008000635B4|2018-05-03|

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JP2008247022A|2008-10-16|

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法律状态:

优先权:

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申请号 | 申请日 | 专利标题

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JP2007059016|2007-03-08|

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JP2008008011A|JP4996488B2|2007-03-08|2008-01-17|Fine pattern forming method|

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PCT/JP2008/054082|WO2008108441A1|2007-03-08|2008-03-06|Method of forming fine pattern, mold formed by the method, transfer method and fine pattern forming method using the mold|

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